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ZPSD502B1-15U

STMicroelectronics

ZPSD502B1-15U by STMicroelectronics

ZPSD502B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded systems requiring low-profile packaging. With a max clock frequency of 34.48 MHz, it ensures efficient performance in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,609 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,609

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Vyrian

USA . 3,363 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,363

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Anansix

USA . 2,560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,855 parts In-Stock

1+ parts

$26.962

100+ parts

-

1k+ parts

$24.265

10k+ parts

-

1,855

$26.962

-

$24.265

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MKK Technologies

India . 1,246 parts In-Stock

1+ parts

$50.699

100+ parts

-

1k+ parts

-

10k+ parts

-

1,246

$50.699

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DigiPath Technology Company

USA . 1,246 parts In-Stock

1+ parts

$50.699

100+ parts

-

1k+ parts

-

10k+ parts

-

1,246

$50.699

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-

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Corohmni

South Africa . 729 parts In-Stock

1+ parts

$72.264

100+ parts

-

1k+ parts

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10k+ parts

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729

$72.264

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Corphita

USA . 3,322 parts In-Stock

1+ parts

-

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10k+ parts

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3,322

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Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

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100+ parts

$32.237

1k+ parts

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10k+ parts

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1,880

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$32.237

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Overview

Unlock a world of innovation with the ZPSD502B1-15U from STMicroelectronics, your trusted partner in cutting-edge technology. This multi-functional peripheral empowers your designs with exceptional reliability and high-performance capabilities, making it ideal for diverse applications ranging from consumer electronics to industrial automation. With its compact form factor and outstanding energy efficiency, elevate your projects while reducing costs and enhancing user experience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures resistance to environmental factors, providing a long-lasting solution.

Surface Mount: YES

Supports surface mount technology for compact design, enabling easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

Offers a wide operating voltage that accommodates various electronic applications with reliable performance.

Address Bus Width: 16

The 16-bit address bus width allows for addressing a larger memory space, enhancing system performance.

Package Shape: SQUARE

The square package shape provides flexibility in layout design, making it suitable for diverse applications.

Power Supplies (V): 5

Standardized 5V power supply ensures compatibility with a myriad of existing systems and devices.

No. of Terminals: 80

A high number of terminals facilitates multiple connections, enhancing functionality and integration capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for efficient space utilization in crowded circuit boards.

Minimum Supply Voltage: 4.5 V

Supports a minimum supply voltage that allows for flexible power management in various applications.

Maximum Operating Temperature: 70 °C

Withstands high temperatures, making it suitable for applications that operate in harsh environments.

Minimum Operating Temperature: 0 °C

Can function in ambient temperatures down to 0 °C, ensuring reliable operation in cool environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability and reliability in connections.

Terminal Position: QUAD

Quad terminal positioning can optimize PCB layout and assembly processes.

Maximum Seated Height: 1.6 mm

The low height facilitates compact designs and reduces overall product profile.

RAM Words: 512

512 words of RAM provides sufficient memory for operations, making it effective for various applications.

Width: 14 mm

Compact width allows for easy integration into tight spaces in product design.

External Data Bus Width: 16

The 16-bit external data bus width maximizes data transfer rates for efficient operation.

Maximum Clock Frequency: 34.48 MHz

High clock frequency ensures quick processing speeds, enhancing system performance.

Length: 14 mm

Short length promotes efficient use of space on circuit boards.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability under normal operating conditions.

ROM Bits Size: 512 Bits

512 bits of ROM provide essential program storage, suitable for many embedded applications.

Technology: CMOS

CMOS technology delivers low power consumption and high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint integrity, ensuring strong connections.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V aligns with standard electronic components, making integration easy.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Extensive bus compatibility allows integration into a variety of systems, providing versatility.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch enables densely packed designs, maximizing board space.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances energy efficiency, beneficial for battery-operated devices.

Maximum Access Time: 0.00000015 ns

Minimal access time ensures rapid data retrieval, boosting overall system responsiveness.

No. of I/O Lines: 40

A total of 40 I/O lines provides flexibility and ample interface options for various peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD502B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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