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ZPSD501B1V-25L

STMicroelectronics

ZPSD501B1V-25L by STMicroelectronics

ZPSD501B1V-25L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its compact ceramic package ensures reliable performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,720 parts In-Stock

1+ parts

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4,720

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Anansix

USA . 1,199 parts In-Stock

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1,199

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Vyrian

USA . 977 parts In-Stock

1+ parts

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977

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,032 parts In-Stock

1+ parts

$67.906

100+ parts

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1k+ parts

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5,032

$67.906

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IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$77.389

100+ parts

-

1k+ parts

$69.650

10k+ parts

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1,723

$77.389

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$69.650

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MKK Technologies

India . 1,668 parts In-Stock

1+ parts

$145.524

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1,668

$145.524

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DigiPath Technology Company

USA . 1,668 parts In-Stock

1+ parts

$145.524

100+ parts

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1,668

$145.524

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Corphita

USA . 1,913 parts In-Stock

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1,913

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Parana Technologies

USA . 124 parts In-Stock

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100+ parts

$92.530

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124

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$92.530

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Overview

Unlock the potential of your designs with the ZPSD501B1V-25L from STMicroelectronics, a trusted leader in innovative technology. This versatile multi-functional peripheral enhances performance across various applications, ensuring reliability and efficiency under demanding conditions. With its compact ceramic and metal-sealed packaging, it not only saves space but also guarantees durability. Choose STMicroelectronics for quality you can depend on and elevate your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material enhances reliability and protects against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, ideal for modern electronic products.

Maximum Supply Voltage: 5.5 V

The flexibility of a maximum supply voltage of 5.5 V offers compatibility with a wider range of power sources.

Address Bus Width: 16

A 16-bit address bus allows for addressing of up to 65,536 memory locations, enhancing its functionality and memory capacity.

Package Shape: SQUARE

The square shape provides efficient space utilization on circuit boards.

No. of Terminals: 68

Having 68 terminals facilitates connections for versatile I/O operations, enhancing functionality.

Package Style (Meter): CHIP CARRIER, WINDOW

This style allows for easy access to the die, which can be beneficial for testing and prototyping.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage ensures the device can operate in low-power situations, making it energy-efficient.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

This range allows the product to function effectively in cooler climates, increasing its practical applications.

Terminal Position: QUAD

Quad terminal positioning offers efficient layout possibilities for complex circuit designs.

Maximum Seated Height: 4.57 mm

A low seated height contributes to compact design, saving precious board space.

RAM Words: 512

With 512 RAM words, the product can handle multiple tasks effectively, facilitating multitasking capabilities.

Width: 24.105 mm

A compact width allows for integration into tight spaces in various applications.

External Data Bus Width: 16

The 16-bit external data bus supports higher data rates, improving overall performance.

Maximum Clock Frequency: 33.33 MHz

A high clock frequency allows for faster processing speeds, enhancing system responsiveness.

Length: 24.105 mm

This length complements the width to form a compact package that fits modern designs.

Temperature Grade: COMMERCIAL

A commercial temperature grade ensures the product is suitable for standard operating conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it efficient for a wide range of applications.

Terminal Form: J BEND

The J bend terminals allow for easier soldering and better mechanical connection, ensuring reliability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V balances efficiency and performance, making it suitable for battery-operated devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows integration into diverse systems, enhancing versatility in design.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is conducive to higher pin densities, maximizing board space usage.

No. of I/O Lines: 40

With 40 I/O lines, the product can efficiently connect to multiple peripherals, enhancing connectivity options.

Technical Specifications

Multi-functional Peripherals ZPSD501B1V-25L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD501B1V-25L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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