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TDA3MVRBFABFRQ1

Texas Instruments

TDA3MVRBFABFRQ1 by Texas Instruments

TDA3MVRBFABFRQ1 by Texas Instruments is a CMOS peripheral IC with 32-bit external data bus, 524288 RAM words, and 38.4 MHz clock frequency. Ideal for automotive applications, it supports CAN(2), I2C(2), QSPI, SPI(4), UART(3) interfaces with AEC-Q100 screening level.

Median Price

$37.592

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,604 parts In-Stock

1+ parts

$37.592

100+ parts

$33.415

1k+ parts

$24.570

10k+ parts

-

3,604

$37.592

$33.415

$24.570

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$33.658

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$33.658

-

-

-

Digiode

USA . 1,905 parts In-Stock

1+ parts

$35.712

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

$35.712

-

-

-

Vyrian

USA . 5,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,483

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$13.100

-

-

-

Parana Technologies

USA . 1,812 parts In-Stock

1+ parts

$27.137

100+ parts

-

1k+ parts

$32.614

10k+ parts

-

1,812

$27.137

-

$32.614

-

DigiPath Technology Company

USA . 1,718 parts In-Stock

1+ parts

$29.881

100+ parts

$27.491

1k+ parts

-

10k+ parts

-

1,718

$29.881

$27.491

-

-

ChromeModa Solutions

Germany . 5,594 parts In-Stock

1+ parts

$30.491

100+ parts

$25.003

1k+ parts

-

10k+ parts

-

5,594

$30.491

$25.003

-

-

IDEA Electronic Components Group

UK . 675 parts In-Stock

1+ parts

$30.491

100+ parts

$28.966

1k+ parts

$27.442

10k+ parts

-

675

$30.491

$28.966

$27.442

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Ampacity Inc.

Singapore . 3,177 parts In-Stock

1+ parts

$31.950

100+ parts

-

1k+ parts

-

10k+ parts

-

3,177

$31.950

-

-

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$33.660

100+ parts

$31.977

1k+ parts

-

10k+ parts

$29.957

500

$33.660

$31.977

-

$29.957

Corphita

USA . 2,288 parts In-Stock

1+ parts

$33.833

100+ parts

-

1k+ parts

-

10k+ parts

-

2,288

$33.833

-

-

-

Corohmni

South Africa . 269 parts In-Stock

1+ parts

$39.739

100+ parts

-

1k+ parts

-

10k+ parts

-

269

$39.739

-

-

-

Microchip USA

USA . 2,793 parts In-Stock

1+ parts

$77.410

100+ parts

$76.070

1k+ parts

$75.390

10k+ parts

$74.720

2,793

$77.410

$76.070

$75.390

$74.720

Overview

Experience a new level of efficiency with the TDA3MVRBFABFRQ1 by Texas Instruments. This multi-functional peripheral offers unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. From automotive applications to industrial settings, this product provides unmatched performance and versatility. Discover the value and benefits it brings to your projects, making your work easier and more efficient. Trust in Texas Instruments to deliver cutting-edge solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting devices.

Maximum Supply Voltage: 1.11 V

Having a high maximum supply voltage allows for flexibility in power input, ensuring stable operation even in varying voltage conditions.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extended use and harsh environmental conditions without overheating.

RAM Words: 524288

Having a large RAM capacity enables the device to handle complex multitasking and data processing efficiently.

Maximum Clock Frequency: 38.4 MHz

A high maximum clock frequency allows for quick data processing and smooth operation, suitable for high-performance tasks.

Bus Compatibility: CAN(2), I2C(2), QSPI, SPI(4), UART(3)

Support for multiple bus interfaces enables seamless connectivity with various devices, enhancing versatility and compatibility.

Technical Specifications

Multi-functional Peripherals TDA3MVRBFABFRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN(2), I2C(2), QSPI, SPI(4), UART(3)

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

126

No. of Serial I/Os:

13

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA367,22X22,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

524288

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TDA3MVRBFABFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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