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X66AK2G12ABY100

Texas Instruments

X66AK2G12ABY100 by Texas Instruments

X66AK2G12ABY100 by Texas Instruments is a multi-functional peripheral IC with 32-bit external data bus width and 16-bit address bus width. It operates at a max supply voltage of 1.05V and is suitable for applications requiring CAN, Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,623 parts In-Stock

1+ parts

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8,623

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Digiode

USA . 3,785 parts In-Stock

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3,785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$6.756

100+ parts

-

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399

$6.756

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One Stop Electronics

USA . 522 parts In-Stock

1+ parts

$23.000

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-

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522

$23.000

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Parana Technologies

USA . 1,444 parts In-Stock

1+ parts

$23.178

100+ parts

-

1k+ parts

$23.813

10k+ parts

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1,444

$23.178

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$23.813

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DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$25.522

100+ parts

$23.480

1k+ parts

-

10k+ parts

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1,244

$25.522

$23.480

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ChromeModa Solutions

Germany . 3,073 parts In-Stock

1+ parts

$26.043

100+ parts

$21.355

1k+ parts

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10k+ parts

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3,073

$26.043

$21.355

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

1+ parts

$26.043

100+ parts

$24.741

1k+ parts

$23.439

10k+ parts

-

1,003

$26.043

$24.741

$23.439

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Corohmni

South Africa . 2,183 parts In-Stock

1+ parts

$34.970

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2,183

$34.970

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Corphita

USA . 3,184 parts In-Stock

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3,184

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Infinite Electronics LLP (Excess)

. 46 parts In-Stock

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46

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Overview

Elevate your electronic designs with the X66AK2G12ABY100 by Texas Instruments. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled performance and reliability. From its cutting-edge technology to its versatile applications, this product is a game-changer in the industry. Experience seamless integration and enhanced functionality with the X66AK2G12ABY100. Trust Texas Instruments for quality you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for portable or stationary use.

Surface Mount: YES

The surface mount capability allows for easy integration into various devices and systems, making it versatile for different applications.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures stable and reliable power delivery to the product, enhancing its performance.

Address Bus Width: 16

With a wide address bus width of 16, the product can efficiently handle large amounts of data and instructions for enhanced functionality.

No. of Terminals: 625

The high number of terminals provides ample connectivity options, enabling seamless communication with other devices and peripherals.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can perform reliably even in challenging environmental conditions.

RAM Words: 1M

With a large RAM word capacity of 1M, the product can efficiently store and access data, facilitating smooth operation and multitasking.

External Data Bus Width: 32

The wide external data bus width of 32 allows for fast and efficient data transfer, enhancing the overall performance of the product.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high speed operation, making the product energy-efficient and responsive.

Bus Compatibility: CAN; ETHERNET; I2C; PCI; SPI; UART; USB

The wide range of bus compatibility options allows the product to easily interface with different communication protocols and devices, increasing its versatility.

Technical Specifications

Multi-functional Peripherals X66AK2G12ABY100 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B625

Length:

21 mm

No. of I/O Lines:

212

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

1M

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

21 mm

Peripheral IC Type:

Trade Compliance

X66AK2G12ABY100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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