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X66AK2G12ABY60

Texas Instruments

X66AK2G12ABY60 by Texas Instruments

X66AK2G12ABY60 by Texas Instruments is a Multi-functional Peripheral IC with 32-bit External Data Bus Width and 16-bit Address Bus Width. It operates b/w 0-70 °C, compatible with CAN, ETHERNET, I2C, PCI, SPI, UART, USB buses. This low-profile device has 625 terminals in a square package for various commercial applications.

Median Price

$54.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 29 parts In-Stock

1+ parts

$54.000

100+ parts

$47.520

1k+ parts

-

10k+ parts

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29

$54.000

$47.520

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Vyrian

USA . 6,403 parts In-Stock

1+ parts

-

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-

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10k+ parts

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6,403

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Digiode

USA . 1,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,461

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-

-

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ACDS - Activité Composants Distribution Service

France . 29 parts In-Stock

1+ parts

-

100+ parts

-

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29

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Dan-Mar Components

USA . 29 parts In-Stock

1+ parts

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29

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,292 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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10k+ parts

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1,292

$7.000

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AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$14.830

100+ parts

-

1k+ parts

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290

$14.830

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Parana Technologies

USA . 1,322 parts In-Stock

1+ parts

$45.774

100+ parts

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10k+ parts

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1,322

$45.774

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DigiPath Technology Company

USA . 598 parts In-Stock

1+ parts

$50.403

100+ parts

$46.371

1k+ parts

-

10k+ parts

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598

$50.403

$46.371

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ChromeModa Solutions

Germany . 6,610 parts In-Stock

1+ parts

$51.432

100+ parts

$42.174

1k+ parts

-

10k+ parts

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6,610

$51.432

$42.174

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

1+ parts

$51.432

100+ parts

$48.860

1k+ parts

$46.289

10k+ parts

-

2,137

$51.432

$48.860

$46.289

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Corohmni

South Africa . 1,877 parts In-Stock

1+ parts

$75.227

100+ parts

-

1k+ parts

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10k+ parts

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1,877

$75.227

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Corphita

USA . 2,711 parts In-Stock

1+ parts

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100+ parts

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2,711

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Overview

Discover the unparalleled quality and reliability of the X66AK2G12ABY60 by Texas Instruments, a leader in electronic components. This multi-functional peripheral device offers a wide range of applications, making it a versatile solution for various projects. With its advanced technology and high-performance features, this product provides exceptional value and benefits to customers, ensuring seamless operation and optimal results. Upgrade your systems with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ensuring long-term use.

Maximum Supply Voltage: 0.945 V

Operates efficiently at a maximum supply voltage of 0.945 V, providing stable performance.

RAM Words: 1M

With 1M RAM words, the product can handle multiple tasks simultaneously, enhancing productivity.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Being a multi-functional peripheral, this product can perform various tasks such as printing, scanning, copying, and more, making it a versatile choice.

Bus Compatibility: CAN; ETHERNET; I2C; PCI; SPI; UART; USB

Compatible with various bus types, allowing seamless connectivity with other devices and networks.

Technical Specifications

Multi-functional Peripherals X66AK2G12ABY60 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B625

Length:

21 mm

No. of I/O Lines:

212

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

1M

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

.945 V

Minimum Supply Voltage:

.855 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

21 mm

Peripheral IC Type:

Trade Compliance

X66AK2G12ABY60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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