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ZPSD512B1-15L

STMicroelectronics

ZPSD512B1-15L by STMicroelectronics

ZPSD512B1-15L by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports multiple bus types, and is ideal for embedded systems requiring reliable data processing. Its compact ceramic package ensures efficient thermal management in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,193 parts In-Stock

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Digiode

USA . 2,626 parts In-Stock

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2,626

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Anansix

USA . 313 parts In-Stock

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313

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$34.425

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$30.983

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2,158

$34.425

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$30.983

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MKK Technologies

India . 1,962 parts In-Stock

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$64.735

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$64.735

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DigiPath Technology Company

USA . 1,962 parts In-Stock

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$64.735

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1,962

$64.735

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Parana Technologies

USA . 1,842 parts In-Stock

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$41.161

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1,842

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$41.161

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Corphita

USA . 1,774 parts In-Stock

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Overview

Unlock innovative potential with the ZPSD512B1-15L from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile multi-functional peripheral is designed for a wide array of applications, enhancing your projects with reliability and performance. Its robust ceramic and metal-sealed construction ensures durability, while its compatibility with various architectures maximizes design flexibility. Elevate your systems with this exceptional component that promises value and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction enhances longevity and protects against environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount design facilitates compact integration onto PCBs, saving space and improving manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various application requirements while ensuring compatibility with standard logic levels.

Address Bus Width: 16

With a 16-bit address bus width, this product can address a larger memory space, making it suitable for more complex applications.

Package Shape: SQUARE

The square package shape maximizes the component's footprint, allowing for efficient space utilization on the circuit board.

No. of Terminals: 68

A higher number of terminals provides more connections for peripherals, enhancing the device's functionality and integration capabilities.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window style design allows for optical inspection and programming, improving ease of use in manufacturing and testing.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures operational stability in a variety of power supply environments.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the product to function reliably in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

Starting from 0 °C ensures the device can be used in cooler conditions, broadening its application range.

Terminal Position: QUAD

The quad terminal position supports efficient PCB layout and simplifies mounting processes.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm allows for low-profile installations, essential for compact electronic designs.

RAM Words: 1024

With 1024 RAM words, the device offers ample memory for storage and processing, ideal for multitasking applications.

Width: 24.105 mm

An optimal width of 24.105 mm fits well within typical PCB layouts, offering design flexibility.

External Data Bus Width: 8

An 8-bit external data bus width ensures compatibility with a wide range of devices, enhancing integration options.

Maximum Clock Frequency: 34.48 MHz

A high maximum clock frequency ensures fast processing speeds, beneficial for applications requiring quick data handling.

Length: 24.105 mm

The measured length of 24.105 mm matches the width, providing a compact form factor for multiple electronic designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product is designed for use in a wide range of everyday environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: J BEND

The J bend terminal form is designed for easy insertion into PCBs, simplifying the assembly and soldering processes.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with popular standards, enhancing compatibility with numerous electronic components.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Extensive bus compatibility allows this product to interface with a variety of microcontrollers and processors, increasing design versatility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with various PCB manufacturing processes while maintaining density.

No. of I/O Lines: 40

With 40 I/O lines, the device can connect to multiple peripherals simultaneously, making it ideal for complex system designs.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-15L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD512B1-15L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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