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ZPSD502B1-70JI

STMicroelectronics

ZPSD502B1-70JI by STMicroelectronics

ZPSD502B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz, supports various bus types, and is ideal for industrial applications due to its wide temp range (-40 °C to 85 °C). With 512 RAM words and compact chip carrier design, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,516 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,516

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Digiode

USA . 1,404 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,404

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Anansix

USA . 1,149 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 141 parts In-Stock

1+ parts

$44.560

100+ parts

-

1k+ parts

$40.104

10k+ parts

-

141

$44.560

-

$40.104

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Corohmni

South Africa . 1,100 parts In-Stock

1+ parts

$73.970

100+ parts

-

1k+ parts

-

10k+ parts

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1,100

$73.970

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MKK Technologies

India . 2,057 parts In-Stock

1+ parts

$83.793

100+ parts

-

1k+ parts

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10k+ parts

-

2,057

$83.793

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DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$83.793

100+ parts

-

1k+ parts

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10k+ parts

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2,057

$83.793

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-

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Parana Technologies

USA . 2,339 parts In-Stock

1+ parts

-

100+ parts

$53.278

1k+ parts

-

10k+ parts

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2,339

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$53.278

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Corphita

USA . 1,099 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,099

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Overview

Unlock endless possibilities with the ZPSD502B1-70JI from STMicroelectronics—a leader in innovative semiconductor solutions. This multi-functional peripheral is designed for versatility in various applications, offering exceptional reliability and performance. With its robust temperature range and impressive compatibility with multiple bus systems, it’s perfect for industrial projects where quality matters. Elevate your designs with a trusted partner that guarantees value and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient manufacturing processes, making this product suitable for modern electronic devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product operates safely within standard voltage ranges, ensuring compatibility with a wide range of systems.

Address Bus Width: 16

A 16-bit address bus width enables efficient data handling and access to larger memory spaces, enhancing overall performance.

Package Shape: SQUARE

The square package shape facilitates easy integration into circuit designs and maximizes space utilization on PCBs.

Power Supplies (V): 5

Designed to operate at 5 V, this product aligns with common microcontroller and digital circuit specifications, ensuring ease of implementation.

No. of Terminals: 68

With 68 terminals, this product offers extensive connectivity options, allowing for versatile integration into complex systems.

Package Style: CHIP CARRIER

Chip carrier packaging provides robust protection for the chip while allowing for greater flexibility in circuit design.

Minimum Supply Voltage: 4.5 V

Operating down to 4.5 V ensures that this product can function in a variety of low-voltage applications without compromising performance.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this product suitable for industrial and demanding environments, ensuring reliability under heat.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for applications in extreme environments, ensuring consistent performance.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and corrosion resistance, enhancing the longevity of the product.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates that this product is more suited for applications requiring robust and permanent storage of data.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and design in multi-functional peripherals, providing improved signal integrity.

Maximum Seated Height: 4.57 mm

The compact seated height makes this product ideal for space-constrained applications, enhancing design versatility.

RAM Words: 512

With 512 RAM words, the product supports a moderate amount of temporary data storage, suitable for various processing tasks.

Width: 24.1808 mm

The specified width allows for compatibility with standard PCB layouts, facilitating easier integration into existing designs.

External Data Bus Width: 16

A 16-bit external data bus width enhances the data transfer rate, making it ideal for applications requiring fast data processing.

Maximum Clock Frequency: 36 MHz

Operating at up to 36 MHz, this product delivers quick processing capabilities, enhancing the performance of multi-functional peripherals.

Length: 24.1808 mm

The compact length supports streamlined designs while enabling ease of handling and integration into diverse applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness, ensuring that the product can withstand challenging manufacturing and environmental conditions.

ROM Bits Size: 512 Bits

With a ROM size of 512 bits, this product is suitable for applications that require a moderate amount of embedded program storage.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making this product efficient for multi-functional designs.

Terminal Form: J BEND

J bend terminal design supports easy mounting and enhances reliability in soldered connections, ensuring stable operation.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V confirms compatibility with a multitude of existing electronics, simplifying system design.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Extensive bus compatibility ensures that this product can be integrated into various systems, enhancing its versatility across applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides compatibility with standard PCB layouts, making the product suitable for widespread use.

Maximum Standby Current: 0.00002 Amp

Low maximum standby current consumption contributes to energy efficiency, making this product a great choice for battery-operated devices.

Maximum Access Time: 0.00000007 ns

An extremely low maximum access time enhances the product's responsiveness, making it ideal for high-performance applications.

No. of I/O Lines: 40

Having 40 I/O lines offers a significant number of input and output options, making the product suitable for complex interfacing.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD502B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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