Loading...

ZPSD501B1-70U

STMicroelectronics

ZPSD501B1-70U by STMicroelectronics

ZPSD501B1-70U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications requiring low power consumption. Its compact flatpack design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,977

-

-

-

-

Vyrian

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Digiode

USA . 457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

457

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$37.029

100+ parts

-

1k+ parts

$33.326

10k+ parts

-

1,825

$37.029

-

$33.326

-

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$39.741

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$39.741

-

-

-

MKK Technologies

India . 1,326 parts In-Stock

1+ parts

$69.631

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$69.631

-

-

-

DigiPath Technology Company

USA . 1,326 parts In-Stock

1+ parts

$69.631

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$69.631

-

-

-

Corphita

USA . 2,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,614

-

-

-

-

Parana Technologies

USA . 435 parts In-Stock

1+ parts

-

100+ parts

$44.274

1k+ parts

-

10k+ parts

-

435

-

$44.274

-

-

Overview

Unlock limitless possibilities with the ZPSD501B1-70U from STMicroelectronics, a leader in innovation and quality. This versatile multi-functional peripheral delivers exceptional performance for embedded systems, enhancing efficiency across diverse applications. With its compact design and robust reliability, it stands out for seamless integration into various projects, ensuring your designs are not just functional but also future-ready. Experience unmatched value and empower your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, ensuring a long-lasting product.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly on printed circuit boards, making this product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with various power supply systems typically used in multi-functional peripherals.

Address Bus Width: 16

A 16-bit address bus width enhances memory access capabilities and allows for addressing a larger memory space, which is beneficial for complex operations.

Package Shape: SQUARE

The square package shape facilitates efficient layout on PCB, optimizing the use of space while maintaining performance.

Power Supplies (V): 5

The nominal power supply requirement of 5 V aligns with standard voltage levels, making the integration of this peripheral straightforward.

No. of Terminals: 80

With 80 terminals, this product provides plenty of connectivity options, accommodating various input/output configurations.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low profile design allows for a slim assembly in devices, making it ideal for portable or compact equipment.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V improves flexibility in power management and energy efficiency.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures the product can function reliably in warm environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product is suitable for a wide range of thermal environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures reliability and good solderability, improving the product's performance in electronic assemblies.

Ultraviolet Erasable: N

The non-ultraviolet erasable feature indicates that this product is stable for applications where data retention is crucial.

Terminal Position: QUAD

The quad terminal position enhances accessibility for connections, making installations easier and simplifying PCB designs.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm ensures a low-profile design, maintaining compatibility with compact electronic designs.

RAM Words: 512

Having 512 RAM words supports moderate data processing needs, suitable for multi-functional operations.

Width: 14 mm

A compact width of 14 mm allows this component to fit into smaller devices without compromising performance.

External Data Bus Width: 16

A 16-bit external data bus width provides enhanced data throughput, improving performance in data-intensive applications.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, this product can handle high-speed processing, enabling efficient operation.

Length: 14 mm

A length of 14 mm complements the compact design, making it suitable for various devices, particularly in the realm of multi-functional peripherals.

Temperature Grade: COMMERCIAL

Rated for commercial temperature conditions, this product is suitable for general-purpose applications without extreme environmental concerns.

ROM Bits Size: 256 Bits

With 256 bits of ROM, this component can store essential firmware or configuration data necessary for operation.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, advantageous for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering characteristics and reliability in connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with industry standards, ensuring compatibility with a wide range of devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility enhances the product's versatility, allowing it to interface with multiple older and modern microcontrollers.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm ensures efficient circuit density while maintaining ease of soldering and manufacturing.

Maximum Standby Current: 0.00002 Amp

Extremely low maximum standby current enhances energy efficiency, making it ideal for power-sensitive applications.

Maximum Access Time: 0.00000007 ns

A rapid access time of 70 ns significantly reduces latency in data retrieval, improving overall system responsiveness.

No. of I/O Lines: 40

With 40 I/O lines, this product offers ample connectivity for various peripherals and components, enhancing its multi-functional capabilities.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD501B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20