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PSD501B1-90LI

STMicroelectronics

PSD501B1-90LI by STMicroelectronics

PSD501B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features an industrial temperature grade, supporting -40 °C to 85°C, and has a max clock frequency of 30 MHz. Ideal for applications requiring robust data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,890 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,890

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Anansix

USA . 2,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,449

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Digiode

USA . 1,658 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,658

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$55.657

100+ parts

-

1k+ parts

$50.092

10k+ parts

-

652

$55.657

-

$50.092

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MKK Technologies

India . 1,488 parts In-Stock

1+ parts

$104.660

100+ parts

-

1k+ parts

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10k+ parts

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1,488

$104.660

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DigiPath Technology Company

USA . 1,488 parts In-Stock

1+ parts

$104.660

100+ parts

-

1k+ parts

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10k+ parts

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1,488

$104.660

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Corphita

USA . 2,478 parts In-Stock

1+ parts

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2,478

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Parana Technologies

USA . 1,611 parts In-Stock

1+ parts

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100+ parts

$66.547

1k+ parts

-

10k+ parts

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1,611

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$66.547

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Overview

Unlock unparalleled performance with the PSD501B1-90LI from STMicroelectronics, a leader in innovative technology. This versatile multi-functional peripheral is crafted for reliability and efficiency, making it ideal for diverse applications—from automotive to industrial systems. With its robust design and exceptional operational range, customers benefit from enhanced longevity and superior functionality, ensuring your projects are powered by quality and precision that stand the test of time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This high-quality construction provides excellent durability and thermal resistance, ensuring reliability in various environments.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs, enhancing the compactness of multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

The maximum voltage capacity allows for flexibility in power supply design, making it adaptable for various applications.

Address Bus Width: 16

With a 16-bit address bus, this product supports larger memory addressing, facilitating complex operations.

Package Shape: SQUARE

The square shape optimizes space usage on PCBs, making it ideal for modern, compact electronic designs.

No. of Terminals: 68

A higher number of terminals allows for versatile connectivity options, making it suitable for sophisticated multi-functional applications.

Package Style: CHIP CARRIER, WINDOW

The chip carrier design with a window aids in heat dissipation and allows for monitoring of the chip's operation conditions.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage enhances the ability to operate in energy-efficient modes, which is essential for battery-operated devices.

Maximum Operating Temperature: 85 °C

A high operating temperature rating makes the product suitable for industrial applications that experience elevated temperatures.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme environments, which is critical for outdoor and industrial applications.

Terminal Position: QUAD

Quad terminal positioning improves connectivity options and installation flexibility in a variety of design layouts.

Maximum Seated Height: 4.57 mm

The low seated height helps in maintaining a slim profile for devices, which is beneficial for portable electronics.

RAM Words: 512

With 512 RAM words, the product can handle significant data, enhancing its capability for multitasking in complex operations.

Width: 24.105 mm

The controlled width dimensions allow for standardized board design, supporting easier integration into existing systems.

External Data Bus Width: 16

A 16-bit external data bus enhances data throughput, making the product suitable for high-speed applications.

Maximum Clock Frequency: 30 MHz

A high clock frequency enables quicker processing speeds, which is ideal for performance-intensive tasks in multi-functional peripherals.

Length: 24.105 mm

The defined length contributes to consistent assembly and optimal spatial arrangement on multilayer PCBs.

Temperature Grade: INDUSTRIAL

Being rated for industrial use ensures durability and reliability under harsh conditions, making it a solid choice for demanding applications.

Technology: CMOS

Using CMOS technology ensures low power consumption while maintaining high performance, making it ideal for energy-sensitive applications.

Terminal Form: J BEND

J-bend terminal form facilitates easier soldering and handling, enhancing assembly efficiency.

Nominal Supply Voltage: 5 V

The nominal voltage of 5V is standard, ensuring compatibility and ease of integration with existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility makes this product versatile across various platforms and existing architectures, minimizing design constraints.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layouts while ensuring reliable electrical connectivity.

No. of I/O Lines: 40

Having 40 I/O lines provides extensive interfacing options, essential for multi-functional peripheral applications.

Technical Specifications

Multi-functional Peripherals PSD501B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD501B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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