Loading...

PSD502B1-70L

STMicroelectronics

PSD502B1-70L by STMicroelectronics

PSD502B1-70L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 512 RAM words and supports various bus architectures, making it ideal for embedded applications. Its ceramic, metal-sealed package ensures durability in commercial environments up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,575

-

-

-

-

Vyrian

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,256

-

-

-

-

Digiode

USA . 1,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,235 parts In-Stock

1+ parts

$75.887

100+ parts

-

1k+ parts

$68.298

10k+ parts

-

1,235

$75.887

-

$68.298

-

MKK Technologies

India . 1,722 parts In-Stock

1+ parts

$142.701

100+ parts

-

1k+ parts

-

10k+ parts

-

1,722

$142.701

-

-

-

DigiPath Technology Company

USA . 1,722 parts In-Stock

1+ parts

$142.701

100+ parts

-

1k+ parts

-

10k+ parts

-

1,722

$142.701

-

-

-

Corphita

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Parana Technologies

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$90.735

1k+ parts

-

10k+ parts

-

119

-

$90.735

-

-

Overview

Elevate your design with the PSD502B1-70L from STMicroelectronics—a pinnacle of quality in multi-functional peripherals. Renowned for their innovation and reliability, STMicroelectronics delivers unmatched performance across diverse applications, from industrial automation to consumer electronics. With its robust ceramic package and superior thermal stability, this versatile chip ensures efficient operation while maximizing your project’s potential. Trust in a leader that values performance as much as you do!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed construction enhances durability and reliability, making this product suitable for demanding environments.

Surface Mount: YES

The surface mount compatibility allows for compact design and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

This wide voltage range ensures flexibility in powering the device without risking damage, adding to its versatility.

Address Bus Width: 16

With a 16-bit address bus, the device can handle large address spaces, allowing more memory and enhanced performance.

Package Shape: SQUARE

The square package shape offers an optimal layout for multi-functional applications, making integration easier.

No. of Terminals: 68

A higher number of terminals provides more connectivity options, supporting complex designs and multiple functionalities.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style is designed for excellent performance while allowing for easy inspection and testing.

Minimum Supply Voltage: 4.5 V

This minimum voltage ensures the device operates effectively in various power conditions, enhancing overall usability.

Maximum Operating Temperature: 70 °C

Rated for high-temperature operation, this product is reliable in hotter environments, ensuring longevity and performance.

Minimum Operating Temperature: 0 °C

The operational range down to 0 °C makes it versatile for various applications in cooler climates.

Terminal Position: QUAD

The quad terminal arrangement simplifies PCB layout and design, ensuring efficient use of space.

Maximum Seated Height: 4.57 mm

A low seated height allows for compact designs without compromising other components' space on the PCB.

RAM Words: 512

With 512 RAM words, this product facilitates substantial data processing capabilities, ideal for multi-functional applications.

Width: 24.105 mm

This width is standard yet allows for effective integration within various electronic systems without significant redesign.

External Data Bus Width: 16

The 16-bit data bus width maximizes data throughput, improving overall system performance during data transfers.

Maximum Clock Frequency: 50 MHz

Operating at 50 MHz enables fast processing speeds, making this device suitable for high-performance applications.

Length: 24.105 mm

A consistent length contributes to uniformity in design, allowing for easier integration into standard layouts.

Temperature Grade: COMMERCIAL

Commercial-grade components ensure reliability under various environmental conditions, catering to a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures lower power consumption and higher efficiency, extending battery life in portable devices.

Terminal Form: J BEND

J bend terminals provide secure mounting and enhanced mechanical stability, which is crucial for maintaining reliable connections.

Nominal Supply Voltage: 5 V

The nominal voltage of 5V is standard and widely supported across various electronic devices, ensuring compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility enables this product to integrate seamlessly with existing systems, reducing design time and costs.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is optimal for both ease of manufacturing and soldering, streamlining assembly processes.

No. of I/O Lines: 40

Having 40 I/O lines provides extensive interfacing options, making the product suitable for a wide variety of multi-functional uses.

Technical Specifications

Multi-functional Peripherals PSD502B1-70L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD502B1-70L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20