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PSD502B1-12JI

Waferscale Integration

PSD502B1-12JI by Waferscale Integration

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,317 parts In-Stock

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Vyrian

USA . 3,130 parts In-Stock

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Anansix

USA . 106 parts In-Stock

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IDEA Electronic Components Group

UK . 1,799 parts In-Stock

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$49.688

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$44.719

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Corohmni

South Africa . 827 parts In-Stock

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$65.640

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MKK Technologies

India . 1,311 parts In-Stock

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$93.436

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DigiPath Technology Company

USA . 1,311 parts In-Stock

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$93.436

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Corphita

USA . 2,386 parts In-Stock

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Parana Technologies

USA . 36 parts In-Stock

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$59.410

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Technical Specifications

Multi-functional Peripherals PSD502B1-12JI attributes and parameters. Explore more Multi-functional Peripherals devices from Waferscale Integration

Specs

Maximum Access Time:

.00000012 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

35.71 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

No. of I/O Lines:

40

No. of Serial I/Os:

0

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Trade Compliance

PSD502B1-12JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Waferscale Integration

STMicroelectronics acquires Waferscale Integration, Inc. After many years of cooperating as their design and manufacturing partner, STMicroelectronics is acquiring provider of programmable system devices (PSDs), Waferscale Integration Inc. (Fremont, California). WSI was a privately held corporation funded by corporate, institutional, private and venture capital investors. Prior to the acquisition, ST held a 14.5% minority interest in the company and will invest $68 million to acquire full ownership. With the acquisition of WSI, ST will obtain the product portfolio, intellectual property and technologies developed by the company in the field of non-volatile memories and memory systems. The acquisition will also reinforce ST's presence in Israel, where ST has a joint Design Center with Altec-Lansing, and in Silicon Valley, where ST already has an advanced Design Center, a joint Design Center with Hitachi and close links with the University of California at Berkeley. WSI is known for PSD products that combine memory functions such as Flash, EEPROM and SRAM with programmable logic on a chip that is designed to work with a standard microcontroller. PSDs can be programmed without special manufacturing equipment, even in the field, making them particularly attractive in applications such as medical equipment, automotive control systems, industrial process control systems, applications where large amounts of parameter updates are required, and low to medium volume applications. "We have been delighted by the acceptance to date of our innovative Flash products. Now that it is supported by ST's manufacturing machine and global resources in product support and development, the PSD concept will proliferate across the ST customer base and will meet the needs of new high volume customers, while providing enhanced service to our current customer base," said Mike Callahan, President and CEO of WSI. WSI's operations will continue to be headquartered in the Silicon Valley area but will now function as an operational Business Unit within STMicroelectronics' Memory Products Group. STMicroelectronics designs, develops, manufactures and markets semiconductor integrated circuits (ICs) and discrete devices used in a wide variety of microelectronic applications, including telecommunications systems, computer systems, consumer products, automotive products and industrial automation and control systems.

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