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PC87351-IBW/VLA

Winbond Electronics

PC87351-IBW/VLA by Winbond Electronics

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,614 parts In-Stock

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Vyrian

USA . 491 parts In-Stock

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491

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Digiode

USA . 96 parts In-Stock

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96

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Nova Conductors

Japan . 56 parts In-Stock

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Cyclops Electronics Ltd

UK . 36 parts In-Stock

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36

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,373 parts In-Stock

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$33.000

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$33.000

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Corohmni

South Africa . 1,130 parts In-Stock

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$72.434

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Assy Fe

Spain . 2,904 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Continental Prestige Electronics

USA . 1,935 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 269 parts In-Stock

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269

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Argo Parts USA

USA . 190 parts In-Stock

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Technical Specifications

Multi-functional Peripherals PC87351-IBW/VLA attributes and parameters. Explore more Multi-functional Peripherals devices from Winbond Electronics

Specs

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

PC-AT; ISA; PS/2

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e0

Length:

20 mm

Moisture Sensitivity Level (MSL):

2A

No. of I/O Lines:

8

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

220

Qualification:

Not Qualified

RAM Words:

256

Maximum Seated Height:

3.15 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

PC87351-IBW/VLA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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