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PSD503B1-90JI

STMicroelectronics

PSD503B1-90JI by STMicroelectronics

PSD503B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max supply voltage of 5.5V, 512 RAM words, and supports various bus types for industrial applications. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,973 parts In-Stock

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2,973

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Digiode

USA . 2,232 parts In-Stock

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2,232

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Anansix

USA . 510 parts In-Stock

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510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 186 parts In-Stock

1+ parts

$14.351

100+ parts

-

1k+ parts

$12.916

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186

$14.351

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$12.916

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Corohmni

South Africa . 1,142 parts In-Stock

1+ parts

$26.123

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1,142

$26.123

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MKK Technologies

India . 627 parts In-Stock

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$26.986

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627

$26.986

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DigiPath Technology Company

USA . 627 parts In-Stock

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$26.986

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627

$26.986

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Corphita

USA . 1,926 parts In-Stock

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Parana Technologies

USA . 501 parts In-Stock

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$17.159

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501

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Overview

Unlock unparalleled performance with the PSD503B1-90JI from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This versatile multi-functional peripheral offers exceptional reliability for industrial applications, operating seamlessly even in extreme conditions. With its compact design and ease of integration, it empowers your projects while maximizing efficiency and longevity. Experience innovation that drives success with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures robustness and protection against environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for a compact design, reducing the overall footprint of the device and enabling high-density layouts in devices.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, the device offers flexibility in power supply range, accommodating various applications and systems.

Address Bus Width: 16

A 16-bit address bus width enhances the data handling capabilities of the device, supporting larger memory architectures and enabling efficient multitasking.

Package Shape: SQUARE

The square package shape provides uniformity in design and placement, facilitating efficient use of PCB space and improving thermal management.

No. of Terminals: 68

With 68 terminals, the device offers ample connectivity options for various peripherals, enhancing its versatility in multi-functional applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging style is conducive to easy integration into circuit boards, simplifying the assembly and reducing production costs.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5V allows for compatibility with low-voltage systems, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

This product can operate at elevated temperatures up to 85 °C, making it suitable for industrial and demanding environments.

Minimum Operating Temperature: -40 °C

Its ability to function at -40 °C makes this device ideal for applications in extreme conditions, such as outdoor and automotive environments.

Terminal Position: QUAD

Quad terminal positioning facilitates versatile routing options on the PCB, enhancing design flexibility.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm contributes to a low-profile design, which is advantageous for compact systems.

RAM Words: 512

With 512 words of RAM, the product is capable of supporting basic data processing tasks effectively, suitable for various applications.

Width: 24.1808 mm

The width of 24.1808 mm aligns with standard PCB dimensions, making it easy to integrate into existing designs.

External Data Bus Width: 16

A 16-bit external data bus width supports high-speed data transfer capabilities, enhancing overall performance in data-intensive applications.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz enables fast processing speeds, ideal for time-sensitive applications.

Length: 24.1808 mm

The length of 24.1808 mm complements its width for a compact, square form factor, optimizing space utilization.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in harsh environments, suitable for a wide range of industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered and sensitive applications.

Terminal Form: J BEND

J bend terminals facilitate robust connections and are suitable for wave soldering, enhancing reliability in circuit assembly.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this device integrates seamlessly with many systems, providing consistent performance.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The extensive bus compatibility allows this device to be easily integrated into various systems, enhancing its versatility across different applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of soldering and high density, suitable for modern, compact designs.

No. of I/O Lines: 40

Having 40 I/O lines provides significant connectivity options for interfacing with other components, making it ideal for multi-functional setups.

Technical Specifications

Multi-functional Peripherals PSD503B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD503B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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