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PSD502B1-70JI

STMicroelectronics

PSD502B1-70JI by STMicroelectronics

PSD502B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It supports a max clock frequency of 36 MHz, ideal for industrial applications. With a temp range of -40 °C to 85°C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,689

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-

-

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Digiode

USA . 2,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,783

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Anansix

USA . 2,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,640

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,452 parts In-Stock

1+ parts

$16.596

100+ parts

-

1k+ parts

-

10k+ parts

-

2,452

$16.596

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IDEA Electronic Components Group

UK . 64 parts In-Stock

1+ parts

$39.244

100+ parts

-

1k+ parts

$35.319

10k+ parts

-

64

$39.244

-

$35.319

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MKK Technologies

India . 1,915 parts In-Stock

1+ parts

$73.795

100+ parts

-

1k+ parts

-

10k+ parts

-

1,915

$73.795

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-

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DigiPath Technology Company

USA . 1,915 parts In-Stock

1+ parts

$73.795

100+ parts

-

1k+ parts

-

10k+ parts

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1,915

$73.795

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-

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Corphita

USA . 2,479 parts In-Stock

1+ parts

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1k+ parts

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2,479

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Parana Technologies

USA . 509 parts In-Stock

1+ parts

-

100+ parts

$46.922

1k+ parts

-

10k+ parts

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509

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$46.922

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Overview

Elevate your designs with the PSD502B1-70JI from STMicroelectronics—your go-to solution for versatile multi-functional peripherals. Renowned for quality and reliability, STMicroelectronics delivers exceptional performance in demanding environments, making this product ideal for industrial applications. Enjoy seamless integration, enhanced efficiency, and a wide range of compatibility, all while benefiting from superior customer support. Transform your projects with unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental stress, making this peripheral reliable in various conditions.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling flexibility in system layouts and saving board space.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this device can be easily integrated into standard low-voltage circuits.

Address Bus Width: 16

A 16-bit address bus width supports a substantial memory addressing range, enhancing performance in complex applications.

Package Shape: SQUARE

The square shape of the package optimizes layout options on circuit boards, providing better fitting in constrained spaces.

No. of Terminals: 68

With 68 terminals, this device offers ample connections for interfacing with various components, supporting sophisticated functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier style aids in effective thermal management and promotes better electrical performance.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5 V allows this peripheral to function effectively in low-power environments.

Maximum Operating Temperature: 85 °C

An operational temperature range up to 85 °C ensures the device performs reliably even in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Extending operational capabilities to -40 °C makes this peripheral suitable for harsh environments such as industrial applications.

Terminal Position: QUAD

The quad terminal position allows for flexible connection options to various circuit configurations and simplifies routing on PCBs.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm enables thin profile designs, crucial for compact and portable devices.

RAM Words: 512

512 RAM words provide adequate memory for data handling in various applications, improving overall performance.

Width: 24.1808 mm

The specified width allows integration into tight spaces while accommodating necessary terminal configurations.

External Data Bus Width: 16

16-bit external data bus width promotes high-speed data transfer rates, making the peripheral efficient in processing capabilities.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz results in higher operational performance, suitable for demanding applications.

Length: 24.1808 mm

The length complements the design, allowing optimal use of real estate on printed circuit boards.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature environments ensures reliability in extreme conditions, making it suitable for long-term use.

Technology: CMOS

Utilizing CMOS technology contributes to low power consumption and high noise immunity, making this device energy-efficient.

Terminal Form: J BEND

J bend terminals facilitate ease of assembly and enhance soldering reliability, critical for high-volume manufacturing.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common logic family standards, increasing compatibility across various systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Supports a wide array of bus standards, which offers exceptional interoperability with existing systems and simplifies integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and manufacturability, enhancing production efficiency.

No. of I/O Lines: 40

With 40 I/O lines, this product is capable of connecting multiple peripherals and components, enhancing system versatility and functionality.

Technical Specifications

Multi-functional Peripherals PSD502B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD502B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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