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PSD502B1-15UI

STMicroelectronics

PSD502B1-15UI by STMicroelectronics

PSD502B1-15UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features low-profile packaging, ideal for industrial applications, and supports various bus types. With a max clock frequency of 34.48 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,005 parts In-Stock

1+ parts

-

100+ parts

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4,005

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Anansix

USA . 1,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,333

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Digiode

USA . 197 parts In-Stock

1+ parts

-

100+ parts

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197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,157 parts In-Stock

1+ parts

$26.689

100+ parts

-

1k+ parts

$24.020

10k+ parts

-

1,157

$26.689

-

$24.020

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MKK Technologies

India . 1,065 parts In-Stock

1+ parts

$50.187

100+ parts

-

1k+ parts

-

10k+ parts

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1,065

$50.187

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DigiPath Technology Company

USA . 1,065 parts In-Stock

1+ parts

$50.187

100+ parts

-

1k+ parts

-

10k+ parts

-

1,065

$50.187

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-

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Corphita

USA . 3,991 parts In-Stock

1+ parts

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3,991

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Parana Technologies

USA . 449 parts In-Stock

1+ parts

-

100+ parts

$31.911

1k+ parts

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10k+ parts

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449

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$31.911

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Overview

Unlock limitless possibilities with the PSD502B1-15UI from STMicroelectronics. Renowned for its excellence, STMicroelectronics delivers a versatile multi-functional peripheral that enhances your applications with reliability and efficiency. Designed for industrial-grade performance, this low-profile component thrives in demanding environments, ensuring optimal functionality while maximizing space. Experience the power of innovation and elevate your projects with unmatched value and benefits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures long-lasting performance and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact design, saving space on printed circuit boards (PCBs) and enabling high-density applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard voltage systems while providing flexibility for design variations.

Address Bus Width: 16

The 16-bit address bus width enhances memory addressing capabilities, allowing for efficient data processing and larger memory integration.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, making it suitable for diverse applications.

Power Supplies (V): 5

Operating at a standard power supply of 5 V ensures ease of integration into existing systems and simplifies design requirements.

No. of Terminals: 80

With 80 terminals, this device can handle multiple input/output connections, allowing for versatile interfacing and communication.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for applications where height is a critical factor, promoting efficient use of limited space.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V provides flexibility in power supply design, allowing for lower power operation.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this product suitable for industrial environments, ensuring stable performance under heat.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures (-40 °C) ensures reliability in harsh conditions, perfect for outdoor and industrial applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and corrosion resistance, enhancing the longevity of connections.

Terminal Position: QUAD

Quad terminal positioning improves layout efficiency on PCBs, facilitating easier routing and connection management.

Maximum Seated Height: 1.6 mm

The low seated height helps in maintaining a slim profile, making it convenient for use in space-constrained designs.

RAM Words: 512

With 512 RAM words, it supports moderate data storage needs, making it suitable for various multi-functional peripheral applications.

Width: 14 mm

At a width of 14 mm, this component strikes a balance between size and functionality, fitting seamlessly into a variety of devices.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 34.48 MHz

A high maximum clock frequency of 34.48 MHz enables faster processing speeds, making it suitable for high-rate applications.

Length: 14 mm

The compact 14 mm length allows for flexible integration into small devices while maximizing functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the component meets rigorous performance standards in demanding environments.

ROM Bits Size: 512 Bits

With 512 bits of ROM, the device can store essential program information, aiding in efficient operation without requiring external memory.

Technology: CMOS

Using CMOS technology provides advantages like low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enhances the reliability of connections on the PCB.

Nominal Supply Voltage: 5 V

Operating on a nominal supply voltage of 5 V ensures widespread compatibility and ease of integration into existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows for versatile applications across different platforms, enhancing design flexibility.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is suitable for modern PCB designs, allowing for denser layouts without compromising performance.

Maximum Standby Current: 0.00002 Amp

A low maximum standby current of 0.00002 A minimizes power consumption during non-active periods, extending battery life.

Maximum Access Time: 0.00000015 ns

Ultra-fast maximum access time of 0.15 ns enables rapid data retrieval, crucial for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, this product offers versatile interfacing options, making it suitable for a wide range of applications.

Technical Specifications

Multi-functional Peripherals PSD502B1-15UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD502B1-15UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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