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PSD502B1-70U

STMicroelectronics

PSD502B1-70U by STMicroelectronics

PSD502B1-70U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features a low-profile flatpack design, ideal for compact applications. With 512 RAM words and a max clock frequency of 50 MHz, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,548 parts In-Stock

1+ parts

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100+ parts

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2,548

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Vyrian

USA . 2,321 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,321

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Anansix

USA . 316 parts In-Stock

1+ parts

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100+ parts

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316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$62.145

100+ parts

-

1k+ parts

$55.931

10k+ parts

-

1,959

$62.145

-

$55.931

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MKK Technologies

India . 845 parts In-Stock

1+ parts

$116.860

100+ parts

-

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10k+ parts

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845

$116.860

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DigiPath Technology Company

USA . 845 parts In-Stock

1+ parts

$116.860

100+ parts

-

1k+ parts

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10k+ parts

-

845

$116.860

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Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

$74.304

1k+ parts

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1,212

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$74.304

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Corphita

USA . 524 parts In-Stock

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524

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Overview

Elevate your next project with the PSD502B1-70U from STMicroelectronics, a trusted leader in multi-functional peripherals. This high-performance, low-profile solution combines reliability and versatility, making it perfect for applications ranging from consumer electronics to industrial automation. Enjoy seamless integration, efficient power management, and robust support, ensuring your innovations are built on a foundation of quality. Experience the difference that superior engineering can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring a reliable and cost-effective design for multi-functional peripherals.

Surface Mount: YES

Allows for compact design and easy integration onto printed circuit boards (PCBs), enhancing manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

Suitable for standard low-voltage applications, reducing the risk of damage from overvoltage conditions.

Address Bus Width: 16

Provides a larger addressable memory space, allowing for more complex operations and features in the peripheral.

Package Shape: SQUARE

Optimally designed for space efficiency on PCBs, making it easier to accommodate in various device layouts.

Power Supplies (V): 5

Standard voltage level, simplifying power supply design and compatibility with other components.

No. of Terminals: 80

Offers extensive connectivity options, allowing for integration with a wide range of interfaces and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables space-saving designs in compact devices, maximizing efficiency in product form factors.

Minimum Supply Voltage: 4.5 V

Ensures operational flexibility in a range of environments, maintaining performance even with slight voltage drops.

Maximum Operating Temperature: 70 °C

Guarantees reliability and performance in high-temperature environments, making it suitable for diverse applications.

Minimum Operating Temperature: 0 °C

Allows operation in a wide range of environmental conditions, enhancing versatility in product deployment.

Terminal Finish: TIN LEAD

Provides excellent solderability and reliability in connections, crucial for long-term performance in mounted devices.

Ultraviolet Erasable: N

Non-erasable design ensures data integrity in critical applications, suitable for permanent data storage needs.

Terminal Position: QUAD

Facilitates easy access to terminals on multiple sides, improving design flexibility and minimizing PCB space.

Maximum Seated Height: 1.6 mm

Low profile design minimizes interference in compact applications, ensuring effective fit in confined spaces.

RAM Words: 512

Ample memory for temporary data storage enhances performance in multi-functional operations and applications.

Width: 14 mm

Compact width allows for versatile integration in space-constrained device designs, improving usability.

External Data Bus Width: 16

Allows for efficient data transfer rates, which is essential for responsive performance in advanced applications.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speeds, making the product suitable for real-time applications.

Length: 14 mm

Short length assists in creating compact circuit designs, facilitating portability and integration into small devices.

Temperature Grade: COMMERCIAL

Qualified for a wide range of commercial applications; ensures reliability in various operating environments.

ROM Bits Size: 512 Bits

Provides sufficient permanent storage for essential firmware and configurations, enhancing operational reliability.

Technology: CMOS

Offers low power consumption and high speed, making this component an efficient choice for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals facilitate effective soldering techniques and improve PCB connection stability.

Nominal Supply Voltage: 5 V

Common voltage standard aids in compatibility with a variety of components, enhancing integration efficiency.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Versatile bus compatibility allows for easy integration with a wide range of existing systems and devices.

Terminal Pitch: 0.65 mm

A finer terminal pitch enables more compact designs, providing options for high-density PCB layouts.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current consumes minimal energy, improving efficiency in power-sensitive applications.

Maximum Access Time: 0.00000007 ns

Fast access times enhance the performance of data retrieval, essential for real-time applications and processing.

No. of I/O Lines: 40

Provides a substantial number of I/O lines for interfacing, enhancing the flexibility and capabilities of the peripheral.

Technical Specifications

Multi-functional Peripherals PSD502B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD502B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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