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PSD513B1-90LI

STMicroelectronics

PSD513B1-90LI by STMicroelectronics

PSD513B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus types, making it ideal for industrial applications. Its compact ceramic package ensures durability in extreme temperatures from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,140 parts In-Stock

1+ parts

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2,140

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Digiode

USA . 1,253 parts In-Stock

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1,253

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Vyrian

USA . 793 parts In-Stock

1+ parts

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793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 596 parts In-Stock

1+ parts

$44.751

100+ parts

-

1k+ parts

$40.276

10k+ parts

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596

$44.751

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$40.276

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Corohmni

South Africa . 595 parts In-Stock

1+ parts

$81.818

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595

$81.818

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MKK Technologies

India . 2,308 parts In-Stock

1+ parts

$84.151

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2,308

$84.151

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DigiPath Technology Company

USA . 2,308 parts In-Stock

1+ parts

$84.151

100+ parts

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2,308

$84.151

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Corphita

USA . 4,380 parts In-Stock

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4,380

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Parana Technologies

USA . 42 parts In-Stock

1+ parts

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$53.506

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42

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$53.506

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Overview

Experience unrivaled performance with the PSD513B1-90LI from STMicroelectronics, a leader in semiconductor innovation. This versatile multi-functional peripheral is crafted for reliability and efficiency, making it ideal for industrial automation, automotive systems, and consumer electronics. With its robust ceramic-metal sealing and wide operating temperature range, this component ensures durability in demanding environments. Elevate your projects and maximize value with ST's top-tier quality and support!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED CO-FIRED

The use of durable ceramic and metal-sealed co-fired materials enhances reliability and protects the internal components from environmental factors, making it ideal for industrial applications.

Surface Mount: YES

Surface mount technology facilitates compact design and allows for automated assembly, which can contribute to reduced manufacturing costs.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage enables versatility in various power supply configurations while ensuring stable operations.

Address Bus Width: 16

A 16-bit address bus width allows for efficient access to a larger memory space, facilitating complex applications.

Package Shape: SQUARE

Square packages are often preferred for ease of layout in circuit designs, optimizing space on printed circuit boards (PCBs).

No. of Terminals: 68

With 68 terminals, this device provides ample connectivity options for various peripherals and functionalities.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window style allows for easy view of the chip, which can be beneficial for debugging and inspection processes.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a wide range of existing systems, enhancing usability in diverse environments.

Maximum Operating Temperature: 85 °C

The high operating temperature tolerance makes this product suitable for operation in challenging industrial environments.

Minimum Operating Temperature: -40 °C

The low operating temperature limit ensures functionality in extreme cold conditions, further extending its application range.

Terminal Position: QUAD

Quad terminal positioning promotes efficient signal integrity and reduces potential interference, enhancing performance.

Maximum Seated Height: 4.57 mm

A lower maximum seated height allows for compact designs, saving space in electronic setups.

RAM Words: 1024

With 1024 RAM words, this product can handle significant data processing demands, making it suitable for complex applications.

Width: 24.105 mm

This width dimension is conducive to fitting well within standard PCB layouts, providing design flexibility.

External Data Bus Width: 8

An 8-bit external data bus allows for compatibility with a variety of microcontrollers, enhancing integration options.

Maximum Clock Frequency: 30 MHz

A maximum clock frequency of 30 MHz ensures fast processing speeds, enabling efficient execution of tasks.

Length: 24.105 mm

A standard length dimension helps maintain design consistency across various applications, simplifying circuit design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product ensures reliable performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered and sensitive applications.

Terminal Form: J BEND

J bend terminals provide better mechanical stability and ease of soldering during assembly processes.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in most applications, facilitating easy integration into existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures this product can interface seamlessly with various microcontrollers and processors, increasing its adaptability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for close placement of components, optimizing space in tight configurations.

No. of I/O Lines: 40

With 40 I/O lines, this product supports extensive peripheral connections, making it highly versatile for various applications.

Technical Specifications

Multi-functional Peripherals PSD513B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD513B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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