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ZPSD502B1-90UI

STMicroelectronics

ZPSD502B1-90UI by STMicroelectronics

ZPSD502B1-90UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 30 MHz, ideal for industrial applications. Its compact flatpack design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,079 parts In-Stock

1+ parts

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4,079

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Vyrian

USA . 2,584 parts In-Stock

1+ parts

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2,584

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Anansix

USA . 1,929 parts In-Stock

1+ parts

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1,929

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 689 parts In-Stock

1+ parts

$68.504

100+ parts

-

1k+ parts

$61.654

10k+ parts

-

689

$68.504

-

$61.654

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MKK Technologies

India . 821 parts In-Stock

1+ parts

$128.818

100+ parts

-

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821

$128.818

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DigiPath Technology Company

USA . 821 parts In-Stock

1+ parts

$128.818

100+ parts

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821

$128.818

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Corphita

USA . 1,823 parts In-Stock

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1,823

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Parana Technologies

USA . 101 parts In-Stock

1+ parts

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100+ parts

$81.907

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101

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$81.907

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Overview

Unlock unparalleled performance with the ZPSD502B1-90UI from STMicroelectronics, a trusted leader in innovative technology. This multi-functional peripheral is designed to elevate your applications with its robust quality and reliability. Featuring exceptional power efficiency and versatile compatibility, it seamlessly integrates into diverse industrial environments. Experience enhanced productivity and peace of mind knowing you're backed by a manufacturer renowned for excellence. Transform your projects with the unmatched value and benefits of the ZPSD502B1-90UI!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy construction ensures durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

The surface mount design allows for compact assembly and efficient use of board space, enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can be used with a variety of power sources, providing versatility in different applications.

Address Bus Width: 16

A 16-bit address bus width allows for a larger addressable memory space, enabling more complex functionality and enhanced performance.

Package Shape: SQUARE

The square package shape allows for efficient board layout and thermal performance, beneficial in high-density designs.

Power Supplies (V): 5

Operating at a standard 5V supply enables compatibility with many existing systems, aiding in easy integration.

No. of Terminals: 80

With 80 terminals, this product can connect with multiple devices and interfaces, enhancing connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style facilitates easy installation in space-constrained environments.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable operation across various power supply conditions.

Maximum Operating Temperature: 85 °C

Designed to operate at temperatures up to 85 °C, making it suitable for high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for extreme cold conditions, ensuring reliable performance.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and reliability in connections.

Terminal Position: QUAD

The quad terminal position optimizes space and improves the routing of connections on printed circuit boards.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a compact design, valuable in soldering and surface mounting.

RAM Words: 512

With 512 RAM words, the product can handle sufficient data processing needs, suitable for various applications.

Width: 14 mm

The compact width of 14 mm allows for efficient use of PCB space.

External Data Bus Width: 16

A 16-bit external data bus width facilitates high-speed data transfers, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The ability to operate at a maximum clock frequency of 30 MHz enables quick processing and efficient data handling.

Length: 14 mm

The 14 mm length contributes to a space-efficient design, ideal for multi-functional peripherals.

Temperature Grade: INDUSTRIAL

Industrial temperature grade assures reliability and performance under harsh operating conditions.

ROM Bits Size: 512 Bits

With a ROM bit size of 512 bits, this peripheral can store essential data and firmware, ensuring smooth operation.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making this product sustainable for long-term use.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and are easier to solder, which increases reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V guarantees effective operation with widely available power sources.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility ensures that this product can easily interface with numerous existing systems, enhancing its applicability.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for a dense layout while maintaining ease of soldering.

Maximum Standby Current: 0.00002 Amp

A low maximum standby current of 0.00002 Amp helps in minimizing power consumption during idle periods, contributing to energy efficiency.

Maximum Access Time: 0.00000009 ns

An incredibly fast access time of 0.09 ns allows for rapid data retrieval, significantly improving system speed.

No. of I/O Lines: 40

With 40 I/O lines, the product supports multiple input and output connections, enhancing its functional versatility.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-90UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD502B1-90UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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