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MCIMX257CJM4AR2

NXP Semiconductors

MCIMX257CJM4AR2 by NXP Semiconductors

MCIMX257CJM4AR2 by NXP Semiconductors features 32-bit architecture, 26-bit address bus width, and 16-bit external data bus width. Ideal for industrial applications requiring low power consumption, this multifunction peripheral IC operates at a max clock frequency of 24 MHz with integrated cache and boundary scan capabilities.

Median Price

$21.627

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MCIMX257CJM4AR2 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 513 parts In-Stock

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$20.070

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513

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$20.070

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Flip Electronics (Authorized)

USA . 513 parts In-Stock

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513

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Verical

USA . 300 parts In-Stock

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$23.184

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300

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$23.184

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Distributors (In-Stock)

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Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$19.720

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43

$19.720

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Digiode

USA . 4,680 parts In-Stock

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4,680

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Vyrian

USA . 4,003 parts In-Stock

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4,003

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Anansix

USA . 2,293 parts In-Stock

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2,293

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Flip Electronics

USA . 513 parts In-Stock

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513

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Distributors (Availability)

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Ampacity Inc.

Singapore . 456 parts In-Stock

1+ parts

$14.050

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456

$14.050

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One Stop Electronics

USA . 217 parts In-Stock

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$14.050

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217

$14.050

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Aztec Data Supply Inc.

USA . 4,120 parts In-Stock

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$14.718

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$14.718

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Continental Prestige Electronics

USA . 4,885 parts In-Stock

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$19.720

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$19.326

4,885

$19.720

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$19.326

Semicontronic

India . 263 parts In-Stock

1+ parts

$30.580

100+ parts

$29.816

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$29.663

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263

$30.580

$29.816

$29.663

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Microchip USA

USA . 2,877 parts In-Stock

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$50.080

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Corohmni

South Africa . 35 parts In-Stock

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$55.873

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35

$55.873

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Advanced Electronics

New Zealand . 42 parts In-Stock

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$67.956

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$64.558

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$64.558

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42

$67.956

$64.558

$64.558

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UNI Independent Distributors

Spain . 7,692 parts In-Stock

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Corphita

USA . 3,392 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$19.326

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$18.734

10k+ parts

$18.340

2,000

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$19.326

$18.734

$18.340

Argo Parts USA

USA . 937 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Overview

Discover the cutting-edge MCIMX257CJM4AR2 by NXP Semiconductors, a top-tier manufacturer known for innovation in the Multi-functional Peripherals category. This versatile product offers unparalleled value with integrated cache, low power mode, and a wide operating temperature range. Ideal for industrial applications, this high-quality device boasts a robust package style and advanced technology, ensuring optimal performance and reliability. Upgrade your systems with the MCIMX257CJM4AR2 and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable multi-functional peripherals.

Integrated Cache: YES

The integrated cache helps improve data transfer speeds and overall performance of the device.

Maximum Supply Voltage: 1.52 V

Higher supply voltage allows for efficient power management and performance optimization.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the device can function in various environments, even in extreme cold conditions.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds, making the multi-functional peripheral efficient in handling multiple tasks simultaneously.

Technical Specifications

Multi-functional Peripherals MCIMX257CJM4AR2 attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3 V I/O SUPPLY

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.52 V

Minimum Supply Voltage:

1.38 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX257CJM4AR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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