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SSM1105V-90T1

STMicroelectronics

SSM1105V-90T1 by STMicroelectronics

SSM1105V-90T1 by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 3.6 V and operates in temperatures up to 70 °C. It features a 16-bit address bus and 68 I/O lines, ideal for compact electronic applications. Its low-profile design ensures efficient space utilization in modern devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,946

-

-

-

-

Digiode

USA . 2,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,083

-

-

-

-

Anansix

USA . 1,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,592

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,646 parts In-Stock

1+ parts

$62.709

100+ parts

-

1k+ parts

$56.438

10k+ parts

-

1,646

$62.709

-

$56.438

-

Corohmni

South Africa . 2,912 parts In-Stock

1+ parts

$66.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,912

$66.865

-

-

-

MKK Technologies

India . 2,336 parts In-Stock

1+ parts

$117.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$117.920

-

-

-

DigiPath Technology Company

USA . 2,336 parts In-Stock

1+ parts

$117.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$117.920

-

-

-

Corphita

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,191

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-

-

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Parana Technologies

USA . 2,146 parts In-Stock

1+ parts

-

100+ parts

$74.978

1k+ parts

-

10k+ parts

-

2,146

-

$74.978

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,000

-

-

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Overview

Unlock unparalleled performance with the SSM1105V-90T1 from STMicroelectronics, a trusted leader in innovative technology. This multi-functional peripheral is designed for versatility and efficiency, perfect for applications ranging from consumer electronics to industrial automation. Its robust construction ensures reliability and longevity, while its low power consumption boosts energy savings. Experience exceptional quality and seamless integration, making your projects more efficient and cost-effective!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and protection against environmental factors, making the product suitable for varied applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, making this peripheral ideal for space-constrained environments.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a range of low-voltage electronic devices.

Address Bus Width: 16

A 16-bit address bus width enables efficient data handling and communication with other devices, enhancing performance.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and simplifies layout on PCBs.

No. of Terminals: 100

With 100 terminals, this peripheral offers extensive connectivity options, allowing for versatile integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack low profile and fine pitch design enable ultra-slim configurations, making it an attractive option for modern devices.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7 V supports operation in various power-sensitive applications, contributing to energy efficiency.

Maximum Operating Temperature: 70 °C

A maximum operational temperature of 70 °C ensures reliability and performance in warm environments.

Minimum Operating Temperature: 0 °C

This range allows the product to be functional in most climates, widening its usability.

Terminal Finish: TIN LEAD

Tin-lead finishing improves solderability and ensures a strong electrical connection, enhancing long-term reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates easier access and better routing on circuit boards, simplifying design and implementation.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm minimizes PCB space usage, making it suitable for compact designs.

Width: 14 mm

At a width of 14 mm, this peripheral strikes a balance between size and functionality, fitting a range of applications.

Boundary Scan: YES

Boundary scan capabilities support easier debugging and testing of integrated circuits, improving development efficiency.

External Data Bus Width: 16

With a 16-bit external data bus width, the device ensures high data transfer rates, enhancing overall system performance.

Length: 14 mm

Matching the width, the length of 14 mm maintains compact dimensions, ideal for modern consumer electronics.

Temperature Grade: COMMERCIAL

Designed for commercial grade usage, this product ensures durability and performance in everyday applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high performance, making it an energy-efficient choice.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and ease of manufacturing, ensuring lasting connections.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is a common standard in the industry, ensuring ease of integration with other components.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher density in component placement, vital for advanced electronic designs.

No. of I/O Lines: 68

With 68 I/O lines, this peripheral provides extensive interfacing capabilities, making it versatile for various applications.

Technical Specifications

Multi-functional Peripherals SSM1105V-90T1 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

68

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SSM1105V-90T1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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