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PSD513B1-70JI

STMicroelectronics

PSD513B1-70JI by STMicroelectronics

PSD513B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and 40 I/O lines. It operates within a supply voltage of 4.5V to 5.5V and supports a max clock frequency of 36 MHz, making it ideal for industrial applications. Its compact chip carrier design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,860 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,860

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-

-

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Anansix

USA . 597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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597

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Vyrian

USA . 298 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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298

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$49.030

100+ parts

-

1k+ parts

$44.127

10k+ parts

-

1,047

$49.030

-

$44.127

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Corohmni

South Africa . 3,044 parts In-Stock

1+ parts

$78.200

100+ parts

-

1k+ parts

-

10k+ parts

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3,044

$78.200

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-

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MKK Technologies

India . 361 parts In-Stock

1+ parts

$92.199

100+ parts

-

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361

$92.199

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DigiPath Technology Company

USA . 361 parts In-Stock

1+ parts

$92.199

100+ parts

-

1k+ parts

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10k+ parts

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361

$92.199

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Corphita

USA . 2,804 parts In-Stock

1+ parts

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2,804

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Parana Technologies

USA . 898 parts In-Stock

1+ parts

-

100+ parts

$58.623

1k+ parts

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10k+ parts

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898

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$58.623

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Overview

Unlock the potential of your next project with the PSD513B1-70JI from STMicroelectronics! Renowned for their cutting-edge technology and reliability, STMicroelectronics delivers a multi-functional peripheral that enhances performance while ensuring robust operation across diverse applications. With its compact design and adaptability, this powerhouse component is perfect for industrial environments, offering unmatched efficiency and durability. Elevate your designs with confidence and experience the ST advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Robust and lightweight material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Facilitates efficient space-saving design and enhances ease of integration onto PCBs.

Maximum Supply Voltage: 5.5 V

Allows compatibility with a wide range of electronic systems without risk of damage.

Address Bus Width: 16

Supports a larger memory space, enhancing the device's capability to handle complex tasks.

Package Shape: SQUARE

Optimizes layout for compact electronic designs, allowing for effective use of space.

No. of Terminals: 68

Provides multiple connection points for enhanced versatility in various applications.

Package Style (Meter): CHIP CARRIER

Ensures stability and reliability in soldering, reducing the chances of mechanical failure.

Minimum Supply Voltage: 4.5 V

Expands operational flexibility with lower voltage requirements for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments, ensuring performance even in high-temperature conditions.

Minimum Operating Temperature: -40 °C

Meets the needs of crucial applications requiring operation in extreme cold environments.

Terminal Position: QUAD

Enhances layout options in PCBs, allowing for more efficient circuit designs.

Maximum Seated Height: 4.57 mm

Low profile design contributes to compact device implementations, ideal for space-constrained applications.

RAM Words: 1024

Provides sufficient memory capacity for complex data processing tasks.

Width: 24.1808 mm

Standard dimension allows for compatibility with numerous existing designs in the market.

External Data Bus Width: 8

Allows efficient data handling and transfer, crucial for high-performance applications.

Maximum Clock Frequency: 36 MHz

High clock speed ensures quick processing capabilities, enhancing overall system performance.

Length: 24.1808 mm

Standardized size promotes easy integration into various systems and PCB designs.

Temperature Grade: INDUSTRIAL

Designed for demanding industrial applications, ensuring long-term reliability and performance.

Technology: CMOS

Offers low power consumption with high-speed performance, making it efficient in various applications.

Terminal Form: J BEND

Enhances physical connectivity options, allowing for improved mechanical strength on the PCB.

Nominal Supply Voltage: 5 V

Standard voltage trading ensures compatibility with most circuits and reduces design complexity.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Widespread bus compatibility allows for broader usage across varied applications and systems.

Terminal Pitch: 1.27 mm

Allows for higher density designs, facilitating modern compact electronic assemblies.

No. of I/O Lines: 40

Offers extensive input/output options for versatile interfacing with other components.

Technical Specifications

Multi-functional Peripherals PSD513B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD513B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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