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ZPSD511B1-15U

STMicroelectronics

ZPSD511B1-15U by STMicroelectronics

ZPSD511B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and is ideal for embedded applications. Its compact flatpack design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,761 parts In-Stock

1+ parts

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3,761

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Digiode

USA . 2,233 parts In-Stock

1+ parts

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2,233

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Anansix

USA . 1,966 parts In-Stock

1+ parts

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1,966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,248 parts In-Stock

1+ parts

$36.029

100+ parts

-

1k+ parts

$32.426

10k+ parts

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1,248

$36.029

-

$32.426

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Corohmni

South Africa . 1,015 parts In-Stock

1+ parts

$47.144

100+ parts

-

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1,015

$47.144

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MKK Technologies

India . 1,640 parts In-Stock

1+ parts

$67.750

100+ parts

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10k+ parts

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1,640

$67.750

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DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$67.750

100+ parts

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1k+ parts

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10k+ parts

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1,640

$67.750

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Corphita

USA . 3,602 parts In-Stock

1+ parts

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3,602

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Parana Technologies

USA . 1,313 parts In-Stock

1+ parts

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100+ parts

$43.078

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1,313

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$43.078

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Overview

Elevate your projects with the ZPSD511B1-15U from STMicroelectronics, a trusted leader in innovative electronic solutions. This versatile multi-functional peripheral excels in various applications, offering exceptional reliability and performance within a compact design. Its low power consumption and broad compatibility make it perfect for diverse electronics, ensuring seamless integration and efficiency. Choose STMicroelectronics for quality that empowers your designs to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy ensures durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, which can reduce production costs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in various low-voltage applications, enhancing compatibility.

Address Bus Width: 16

A 16-bit address bus width supports a larger memory address space, making it capable of handling more data efficiently.

Package Shape: SQUARE

The square package shape facilitates easier integration into circuit layouts and optimizes space utilization on PCBs.

Power Supplies (V): 5

Operating with standard 5V power supplies simplifies design and reduces the need for specialized power management.

No. of Terminals: 80

Having 80 terminals allows for extensive connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile design is ideal for compact devices, making it suitable for modern electronic applications where space is critical.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures operation in various environments, enhancing reliability.

Maximum Operating Temperature: 70 °C

Capable of operating at temperatures up to 70 °C ensures reliability in warm environments, making it suitable for many industrial applications.

Minimum Operating Temperature: 0 °C

Operating from 0 °C provides flexibility in applications requiring functionality at low temperatures.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability, resulting in better connections and reliability in installations.

Terminal Position: QUAD

Quad terminal position allows for efficient placement and routing on a PCB, optimizing layout options.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for space-constrained designs, contributing to thinner product profiles.

RAM Words: 1024

Having 1024 RAM words increases operational capability, enabling more complex processing tasks.

Width: 14 mm

A compact width of 14 mm suits modern devices, making it versatile for various consumer electronics.

External Data Bus Width: 8

An 8-bit external data bus width ensures compatibility with a variety of microcontrollers, enhancing versatility.

Maximum Clock Frequency: 34.48 MHz

A maximum clock frequency of 34.48 MHz allows for high-speed data processing, improving overall performance.

Length: 14 mm

Short length contributes to overall compactness, facilitating deployment in tight spaces.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures ensures reliability in general-purpose applications without extreme conditions.

ROM Bits Size: 256 Bits

A ROM size of 256 bits is sufficient for storing essential information, supporting efficient system operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance the ease of soldering, ensuring secure connections in manufacturing processes.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V aligns with commonly used standards, simplifying integration into existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility provides flexibility to work with various architectures, making it a versatile choice for different applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density designs, catering to modern electronics that require compact layouts.

Maximum Standby Current: 0.00002 Amp

A very low maximum standby current enhances energy efficiency, resulting in longer battery life in portable devices.

Maximum Access Time: 0.00000015 ns

Extremely fast access time ensures prompt data retrieval, improving the response time of the overall system.

No. of I/O Lines: 40

Having 40 I/O lines enhances connectivity options, enabling numerous interfaces and peripherals to be connected, offering greater functionality.

Technical Specifications

Multi-functional Peripherals ZPSD511B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD511B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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