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MIMX8ML3CVNKZAB

NXP Semiconductors

MIMX8ML3CVNKZAB by NXP Semiconductors

The NXP Semiconductors MIMX8ML3CVNKZAB is a multi-functional peripheral IC with 888832 RAM words, 24 MHz clock frequency, and 160 I/O lines. It is suitable for industrial applications requiring Ethernet, I2C, I2S, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with low profile and fine pitch terminals in a square shape measuring 15mm x 15mm.

Median Price

$53.630

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 165 parts In-Stock

1+ parts

$53.630

100+ parts

$36.280

1k+ parts

-

10k+ parts

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165

$53.630

$36.280

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-

Chip1Stop

Japan . 57 parts In-Stock

1+ parts

$54.600

100+ parts

$31.900

1k+ parts

-

10k+ parts

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57

$54.600

$31.900

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-

DigiKey

USA . 64 parts In-Stock

1+ parts

$57.660

100+ parts

$44.918

1k+ parts

$41.752

10k+ parts

-

64

$57.660

$44.918

$41.752

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Verical

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$34.724

10k+ parts

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1,890

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-

$34.724

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Rochester

USA . 565 parts In-Stock

1+ parts

-

100+ parts

$29.180

1k+ parts

$26.110

10k+ parts

$24.580

565

-

$29.180

$26.110

$24.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,716 parts In-Stock

1+ parts

$30.808

100+ parts

-

1k+ parts

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4,716

$30.808

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$47.174

100+ parts

-

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50

$47.174

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-

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Maritex

Poland . 4 parts In-Stock

1+ parts

$79.138

100+ parts

$46.410

1k+ parts

-

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4

$79.138

$46.410

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Vyrian

USA . 4,962 parts In-Stock

1+ parts

-

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4,962

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Flip Electronics

USA . 1,193 parts In-Stock

1+ parts

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1,193

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Anansix

USA . 431 parts In-Stock

1+ parts

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431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,573 parts In-Stock

1+ parts

$21.700

100+ parts

-

1k+ parts

-

10k+ parts

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2,573

$21.700

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Ampacity Inc.

Singapore . 431 parts In-Stock

1+ parts

$27.570

100+ parts

-

1k+ parts

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10k+ parts

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431

$27.570

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Semicontronic

India . 10 parts In-Stock

1+ parts

$27.570

100+ parts

$26.881

1k+ parts

$26.743

10k+ parts

-

10

$27.570

$26.881

$26.743

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Corphita

USA . 2,470 parts In-Stock

1+ parts

$29.187

100+ parts

-

1k+ parts

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10k+ parts

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2,470

$29.187

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Continental Prestige Electronics

USA . 4,517 parts In-Stock

1+ parts

$47.174

100+ parts

-

1k+ parts

-

10k+ parts

$46.230

4,517

$47.174

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-

$46.230

Netroflash

USA . 50 parts In-Stock

1+ parts

$47.174

100+ parts

$46.230

1k+ parts

-

10k+ parts

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50

$47.174

$46.230

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-

Advanced Electronics

New Zealand . 81 parts In-Stock

1+ parts

$47.432

100+ parts

$45.060

1k+ parts

$45.060

10k+ parts

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81

$47.432

$45.060

$45.060

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Corohmni

South Africa . 2,190 parts In-Stock

1+ parts

$57.632

100+ parts

-

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2,190

$57.632

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Microchip USA

USA . 1,754 parts In-Stock

1+ parts

$106.330

100+ parts

-

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1,754

$106.330

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Lixinc

USA . 8,765 parts In-Stock

1+ parts

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8,765

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Argo Parts USA

USA . 2,933 parts In-Stock

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2,933

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Robosynatics

Brazil . 1,500 parts In-Stock

1+ parts

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1,500

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Lucentia Tech

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.821

1k+ parts

$1.821

10k+ parts

$1.821

1,500

-

$1.821

$1.821

$1.821

UNI Independent Distributors

Spain . 156 parts In-Stock

1+ parts

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156

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Overview

Enhance your electronic devices with the MIMX8ML3CVNKZAB by NXP Semiconductors, a top-quality multi-functional peripheral that delivers exceptional performance and versatility. Manufactured by industry leaders, this product offers a wide range of applications and benefits to customers. Whether you're looking to improve connectivity, enhance functionality, or boost efficiency, this cutting-edge technology is the perfect solution. Upgrade your products and stay ahead of the competition with the MIMX8ML3CVNKZAB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of robust plastic/epoxy material ensures durability and longevity of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the device on various surfaces.

Maximum Supply Voltage: 0.9 V

Operating at a maximum supply voltage of 0.9V ensures energy efficiency and optimal performance.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for seamless integration into any setup.

No. of Terminals: 548

With a high number of terminals, this product offers versatile connectivity options for different devices.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient signal transmission and reduced interference.

Minimum Supply Voltage: 0.805 V

The minimum supply voltage of 0.805V allows for energy savings and reliable operation at low power levels.

Maximum Operating Temperature: 105 °C

Operating at a maximum temperature of 105°C ensures stable performance even in challenging conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and maintenance of the device.

Maximum Seated Height: 1.481 mm

The maximum seated height of 1.481mm enables a compact and streamlined design for space-constrained applications.

RAM Words: 888832

With a large RAM capacity of 888832 words, this product can handle complex multitasking and data processing efficiently.

Width: 15 mm

The 15mm width offers a compact form factor that can fit into tight spaces without compromising on performance.

Boundary Scan: YES

The boundary scan feature allows for easy debugging and testing of the device, ensuring reliable operation.

Maximum Clock Frequency: 24 MHz

Operating at a maximum clock frequency of 24MHz enables fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and component alignment during installation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees secure and reliable solder joints for long-term use.

Length: 15 mm

The 15mm length offers a compact and portable design for easy integration into various setups.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand harsh environmental conditions and heavy-duty applications.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

As a multifunction peripheral, this product offers diverse functionalities for enhanced productivity and performance.

Technology: CMOS

Built with CMOS technology, this product delivers efficient power consumption and high-speed processing capabilities.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections for stable data transmission.

Nominal Supply Voltage: 0.85 V

Operating at a nominal supply voltage of 0.85V ensures optimal performance and energy efficiency.

No. of Serial I/Os: 16

With 16 serial I/Os, this product offers versatile connectivity options for seamless data transfer between devices.

Bus Compatibility: ETHERNET, I2C, I2S, PCI, SPI, UART, USB

With compatibility for various bus interfaces, this product can easily integrate with different systems and devices.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables precise connections and efficient signal transmission for reliable performance.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product is resistant to moisture and can withstand humid environments without compromising functionality.

No. of I/O Lines: 160

With 160 I/O lines, this product offers ample connectivity options for seamless data exchange between devices.

Technical Specifications

Multi-functional Peripherals MIMX8ML3CVNKZAB attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B548

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

160

No. of Serial I/Os:

16

No. of Terminals:

548

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,29X29,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

888832

Maximum Seated Height:

1.481 mm

Maximum Supply Voltage:

.9 V

Minimum Supply Voltage:

.805 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MIMX8ML3CVNKZAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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