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MIMX8ML4CVNKZAB

NXP Semiconductors

MIMX8ML4CVNKZAB by NXP Semiconductors

The NXP Semiconductors MIMX8ML4CVNKZAB is a multi-functional peripheral IC with 888832 RAM words, 24 MHz max clock frequency, and 160 I/O lines. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, SPI, UART, and USB bus compatibility in a compact square package with low profile grid array style.

Median Price

$45.270

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 13 parts In-Stock

1+ parts

$43.500

100+ parts

$30.600

1k+ parts

-

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13

$43.500

$30.600

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Verical

USA . 882 parts In-Stock

1+ parts

$43.870

100+ parts

$32.980

1k+ parts

$30.570

10k+ parts

-

882

$43.870

$32.980

$30.570

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Mouser Electronics

USA . 1,486 parts In-Stock

1+ parts

$45.270

100+ parts

$33.170

1k+ parts

-

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1,486

$45.270

$33.170

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DigiKey

USA . 836 parts In-Stock

1+ parts

$46.330

100+ parts

$35.785

1k+ parts

$32.357

10k+ parts

-

836

$46.330

$35.785

$32.357

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Arrow

USA . 6 parts In-Stock

1+ parts

$48.590

100+ parts

$33.070

1k+ parts

$32.100

10k+ parts

-

6

$48.590

$33.070

$32.100

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Avnet

USA . 3,654 parts In-Stock

1+ parts

-

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3,654

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EBV Elektronik

Germany . 1,008 parts In-Stock

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1,008

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Distributors (In-Stock)

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Digiode

USA . 799 parts In-Stock

1+ parts

$42.275

100+ parts

-

1k+ parts

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799

$42.275

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Nova Conductors

Japan . 66 parts In-Stock

1+ parts

$48.258

100+ parts

-

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66

$48.258

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Vyrian

USA . 6,992 parts In-Stock

1+ parts

-

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6,992

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NAC Semi

USA . 3,276 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$48.800

10k+ parts

$45.050

3,276

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-

$48.800

$45.050

Anansix

USA . 2,345 parts In-Stock

1+ parts

-

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2,345

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IBS Electronics

USA . 630 parts In-Stock

1+ parts

-

100+ parts

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$39.158

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630

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-

$39.158

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Bristol Electronics

USA . 580 parts In-Stock

1+ parts

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580

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Atlantic Semiconductor

USA . 580 parts In-Stock

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580

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Chip Stock

USA . 566 parts In-Stock

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566

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TME

Poland . 126 parts In-Stock

1+ parts

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100+ parts

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$39.590

10k+ parts

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126

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$39.590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$18.931

100+ parts

$17.985

1k+ parts

$17.985

10k+ parts

-

700

$18.931

$17.985

$17.985

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Aztec Data Supply Inc.

USA . 2,575 parts In-Stock

1+ parts

$19.670

100+ parts

-

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2,575

$19.670

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Corphita

USA . 4,623 parts In-Stock

1+ parts

$40.050

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-

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4,623

$40.050

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Corohmni

South Africa . 1,014 parts In-Stock

1+ parts

$44.199

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-

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1,014

$44.199

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Continental Prestige Electronics

USA . 2,826 parts In-Stock

1+ parts

$48.258

100+ parts

-

1k+ parts

-

10k+ parts

$47.293

2,826

$48.258

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-

$47.293

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$48.258

100+ parts

$47.293

1k+ parts

-

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2,000

$48.258

$47.293

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Semicontronic

India . 250 parts In-Stock

1+ parts

$55.020

100+ parts

$53.644

1k+ parts

$53.369

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250

$55.020

$53.644

$53.369

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Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$55.020

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141

$55.020

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Modulus Dynamics

Lithuania . 3,673 parts In-Stock

1+ parts

$55.923

100+ parts

$55.923

1k+ parts

$55.923

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3,673

$55.923

$55.923

$55.923

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Microchip USA

USA . 2,551 parts In-Stock

1+ parts

$101.799

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2,551

$101.799

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Lixinc

USA . 10,602 parts In-Stock

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10,602

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Argo Parts USA

USA . 4,829 parts In-Stock

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4,829

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UNI Independent Distributors

Spain . 2,308 parts In-Stock

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2,308

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Robosynatics

Brazil . 953 parts In-Stock

1+ parts

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953

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Lucentia Tech

USA . 953 parts In-Stock

1+ parts

-

100+ parts

$75.937

1k+ parts

$74.388

10k+ parts

$74.388

953

-

$75.937

$74.388

$74.388

Overview

Unlock endless possibilities with the MIMX8ML4CVNKZAB by NXP Semiconductors, a cutting-edge multi-functional peripheral that delivers unmatched quality and reliability. This versatile product boasts a wide range of applications, providing users with seamless integration and exceptional performance. From its innovative design to its advanced technology, this product offers unparalleled value and benefits to customers looking to elevate their projects to new heights. Experience the difference with NXP Semiconductors and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and maintenance of the product.

Maximum Supply Voltage: 0.9 V

With a high maximum supply voltage, this product can handle a range of power inputs.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for the product.

No. of Terminals: 548

The high number of terminals allows for versatile connections and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient signal transmission and performance.

Minimum Supply Voltage: 0.805 V

The low minimum supply voltage helps in energy efficiency and reduces power consumption.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in a wide range of temperatures.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and allows for easy connections.

Maximum Seated Height: 1.481 mm

The low maximum seated height contributes to the compact and sleek design of the product.

RAM Words: 888832

The high RAM words capacity allows for efficient data storage and processing.

Width: 15 mm

The compact width of the product makes it suitable for space-constrained environments.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the product.

Maximum Clock Frequency: 24 MHz

With a high maximum clock frequency, this product can handle high-speed data processing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperatures for up to 40 seconds, ensuring reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product's durability during the manufacturing process.

Length: 15 mm

The compact length of the product makes it suitable for compact and portable systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate in harsh industrial environments.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

The multifunction peripheral type provides versatile functionality for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance for the product.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections for the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a stable power input for the product.

No. of Serial I/Os: 16

The high number of serial I/Os allows for versatile connectivity options and data transfer.

Bus Compatibility: ETHERNET, I2C, I2S, PCI, SPI, UART, USB

The product is compatible with a wide range of bus interfaces, providing flexibility in connectivity.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact packaging and efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product's resistance to moisture damage.

No. of I/O Lines: 160

The high number of I/O lines provides versatile interface options for the product.

Technical Specifications

Multi-functional Peripherals MIMX8ML4CVNKZAB attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B548

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

160

No. of Serial I/Os:

16

No. of Terminals:

548

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,29X29,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

888832

Maximum Seated Height:

1.481 mm

Maximum Supply Voltage:

.9 V

Minimum Supply Voltage:

.805 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MIMX8ML4CVNKZAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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