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AXM0F243-1-TB05

Onsemi

AXM0F243-1-TB05 by Onsemi

AXM0F243-1-TB05 by Onsemi is a 40-terminal multifunction peripheral IC with 4096 RAM words, operating at up to 50 MHz. Ideal for industrial applications, it supports I2C, SPI, and UART bus compatibility with a supply voltage range of 1.8V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,401 parts In-Stock

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Vyrian

USA . 66 parts In-Stock

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66

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Native Components

USA . 783 parts In-Stock

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$0.859

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783

$0.859

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Northwest PG Solutions

USA . 748 parts In-Stock

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$0.944

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748

$0.944

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Problanco Electronics

Mexico . 8,342 parts In-Stock

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Kulean Microsystems

USA . 5,310 parts In-Stock

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SupplyDigital Components

Austria . 4,258 parts In-Stock

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TANS Electronics

Latvia . 1,561 parts In-Stock

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Corphita

USA . 1,036 parts In-Stock

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1,036

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Overview

Experience the cutting-edge technology of Onsemi with the AXM0F243-1-TB05, a versatile multi-functional peripheral that offers unparalleled performance and reliability. Designed for a wide range of applications, this product boasts a high-quality design that ensures seamless integration into any system. With features like a maximum clock frequency of 50 MHz and compatibility with I2C, SPI, and UART buses, the AXM0F243-1-TB05 provides exceptional value and benefits to customers looking for top-notch peripherals. Upgrade your systems today and discover the advantages of this innovative product from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making the product more compact and efficient.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile and adaptable to different system requirements.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to work with, ensuring compatibility with standard PCB designs and assembly processes.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy efficient and reliable.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact design, ideal for applications where space is limited.

RAM Words: 4096

With a large RAM capacity, this product can store and process a significant amount of data, enhancing its performance and capabilities.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency enables fast data processing and response times, making this product suitable for applications requiring high-speed operation.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade environments, this product is rugged and reliable, able to withstand harsh conditions and ensure consistent performance in demanding applications.

No. of Serial I/Os: 3

The multiple serial I/Os provide versatile connectivity options and support for different communication protocols, enhancing the product's compatibility and flexibility.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces allows for seamless integration with various systems and devices, expanding the product's connectivity and interoperability.

Technical Specifications

Multi-functional Peripherals AXM0F243-1-TB05 attributes and parameters. Explore more Multi-functional Peripherals devices from Onsemi

Specs

Boundary Scan:

NO

Bus Compatibility:

I2C; SPI; UART

Maximum Clock Frequency:

50 MHz

JESD-30 Code:

R-XQCC-N40

Length:

7 mm

No. of I/O Lines:

20

No. of Serial I/Os:

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2X.28,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

4096

Maximum Seated Height:

1 mm

Maximum Supply Current:

6.85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

AXM0F243-1-TB05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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