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PSD511B1-70U

STMicroelectronics

PSD511B1-70U by STMicroelectronics

PSD511B1-70U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features a low-profile flatpack design, ideal for compact applications. With 1024 RAM words and compatibility across various bus systems, it suits diverse embedded solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,665 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,665

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Digiode

USA . 2,641 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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2,641

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Vyrian

USA . 315 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,061 parts In-Stock

1+ parts

$40.807

100+ parts

-

1k+ parts

$36.726

10k+ parts

-

2,061

$40.807

-

$36.726

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MKK Technologies

India . 1,094 parts In-Stock

1+ parts

$76.734

100+ parts

-

1k+ parts

-

10k+ parts

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1,094

$76.734

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DigiPath Technology Company

USA . 1,094 parts In-Stock

1+ parts

$76.734

100+ parts

-

1k+ parts

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10k+ parts

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1,094

$76.734

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Parana Technologies

USA . 894 parts In-Stock

1+ parts

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100+ parts

$48.790

1k+ parts

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894

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$48.790

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Corphita

USA . 454 parts In-Stock

1+ parts

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454

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Overview

Unlock the potential of your applications with the PSD511B1-70U from STMicroelectronics! Renowned for quality and innovation, STMicroelectronics delivers a reliable multi-functional peripheral that enhances performance across diverse industries. Designed for efficiency, this compact solution ensures seamless integration while operating in challenging environments. Experience superior value, reduced power consumption, and exceptional reliability, making it an ideal choice for modern electronics. Embrace the future with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into modern compact electronic designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply configurations in multi-functional peripherals.

Address Bus Width: 16

With a 16-bit address bus width, it can address a larger memory space, suitable for complex and memory-intensive applications.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space and simplifies mounting and alignment during assembly.

Power Supplies (V): 5

Operating at a standard 5V supply makes it easy to integrate with existing systems and reduces design complexity.

No. of Terminals: 80

A higher number of terminals allows for more connections, increasing functionality and connectivity options for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for space-constrained applications and enhances thermal performance.

Minimum Supply Voltage: 4.5 V

The ability to operate down to 4.5 V ensures flexibility in power supply options and can maintain functionality in varying conditions.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates reliability in warm environments, which is crucial for many industrial applications.

Minimum Operating Temperature: 0 °C

This specification ensures the device functions well in lower temperatures, expanding its usability in diverse settings.

Terminal Finish: TIN LEAD

The tin-lead finish ensures reliable soldering and good electrical conductivity, enhancing performance and longevity.

Terminal Position: QUAD

Quadrant terminal positioning improves accessibility and reduces layout complexity on PCBs, facilitating easier assembly.

Maximum Seated Height: 1.6 mm

A low seated height contributes to a thinner overall profile of the device, making it suitable for compact devices.

RAM Words: 1024

Providing 1024 words of RAM allows for ample temporary storage, improving performance in processing tasks.

Width: 14 mm

A compact width fits well in smaller devices, aiding in design versatility and space-saving.

External Data Bus Width: 8

An 8-bit external data bus width is standard for compatibility with many devices and simplifies data management.

Maximum Clock Frequency: 50 MHz

Operating at a high clock frequency ensures fast processing speeds, making the product suitable for demanding applications.

Length: 14 mm

A compact length facilitates integration into confined spaces, making it an excellent choice for portable devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade offers reliability for most environments without extreme conditions, making it versatile.

ROM Bits Size: 256 Bits

A 256-bit ROM size provides sufficient storage for firmware, enabling the operation of complex functionalities.

Technology: CMOS

CMOS technology enhances energy efficiency and performance, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals ensure ease of soldering and improved mechanical stability on PCBs.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage represents a widely used standard, facilitating compatibility with numerous devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility expands the usability of this product across various architectures and systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser arrangements on PCBs, optimizing space utilization.

Maximum Standby Current: 0.00002 Amp

Ultra-low standby current enhances energy efficiency, making it suitable for battery-operated applications.

Maximum Access Time: 0.00000007 ns

Extremely fast access time improves response rates, ensuring high-speed performance in processing tasks.

No. of I/O Lines: 40

With 40 I/O lines, this product provides significant connectivity options for peripheral devices, enhancing functionality.

Technical Specifications

Multi-functional Peripherals PSD511B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD511B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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