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CY8C5667LTI-LP041

Infineon Technologies

CY8C5667LTI-LP041 by Infineon Technologies

Infineon's CY8C5667LTI-LP041 is a 68-terminal chip with 16384 RAM words, operating at up to 33 MHz. Ideal for industrial applications, it supports I2C, USB, and PS/2 bus compatibility with a max supply voltage of 5.5V. The CMOS technology device has a temperature range from -40°C to 85°C and features boundary scan capability.

Median Price

$18.560

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2 parts In-Stock

1+ parts

$10.640

100+ parts

-

1k+ parts

-

10k+ parts

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2

$10.640

-

-

-

DigiKey

USA . 3,146 parts In-Stock

1+ parts

$18.560

100+ parts

$12.794

1k+ parts

$11.985

10k+ parts

-

3,146

$18.560

$12.794

$11.985

-

Mouser Electronics

USA . 97 parts In-Stock

1+ parts

$18.560

100+ parts

$12.780

1k+ parts

$11.980

10k+ parts

-

97

$18.560

$12.780

$11.980

-

Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$19.400

100+ parts

-

1k+ parts

-

10k+ parts

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70

$19.400

-

-

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Element14

Singapore . 4 parts In-Stock

1+ parts

$21.640

100+ parts

$17.010

1k+ parts

-

10k+ parts

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4

$21.640

$17.010

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-

EBV Elektronik

Germany . 13,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

13,000

-

-

-

-

Rochester

USA . 5,055 parts In-Stock

1+ parts

-

100+ parts

$10.880

1k+ parts

$9.730

10k+ parts

$9.160

5,055

-

$10.880

$9.730

$9.160

Verical

USA . 4,160 parts In-Stock

1+ parts

-

100+ parts

$13.600

1k+ parts

$12.162

10k+ parts

$11.450

4,160

-

$13.600

$12.162

$11.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 27 parts In-Stock

1+ parts

$11.476

100+ parts

-

1k+ parts

-

10k+ parts

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27

$11.476

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$15.220

100+ parts

-

1k+ parts

-

10k+ parts

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900

$15.220

-

-

-

TME

Poland . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.400

14,000

-

-

-

$9.400

NAC Semi

USA . 10,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$29.110

10,400

-

-

-

$29.110

Vyrian

USA . 3,378 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,378

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-

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Electronics Depot

USA . 107 parts In-Stock

1+ parts

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100+ parts

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107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,325 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

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3,325

$10.000

-

-

-

Semicontronic

India . 2,997 parts In-Stock

1+ parts

$10.010

100+ parts

$9.760

1k+ parts

$9.710

10k+ parts

-

2,997

$10.010

$9.760

$9.710

-

Corphita

USA . 471 parts In-Stock

1+ parts

$10.872

100+ parts

-

1k+ parts

-

10k+ parts

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471

$10.872

-

-

-

Component Stockers USA

USA . 6,226 parts In-Stock

1+ parts

$12.250

100+ parts

$11.510

1k+ parts

$10.410

10k+ parts

-

6,226

$12.250

$11.510

$10.410

-

Continental Prestige Electronics

USA . 1,051 parts In-Stock

1+ parts

$15.220

100+ parts

-

1k+ parts

-

10k+ parts

$14.916

1,051

$15.220

-

-

$14.916

Netroflash

USA . 100 parts In-Stock

1+ parts

$15.220

100+ parts

$14.916

1k+ parts

-

10k+ parts

-

100

$15.220

$14.916

-

-

Advanced Electronics

New Zealand . 55 parts In-Stock

1+ parts

$16.832

100+ parts

$15.485

1k+ parts

$14.510

10k+ parts

-

55

$16.832

$15.485

$14.510

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Corohmni

South Africa . 3,068 parts In-Stock

1+ parts

$39.410

100+ parts

-

1k+ parts

-

10k+ parts

-

3,068

$39.410

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-

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Aztec Data Supply Inc.

USA . 1,680 parts In-Stock

1+ parts

$64.765

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$64.765

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Modulus Dynamics

Lithuania . 790 parts In-Stock

1+ parts

$83.453

100+ parts

$80.115

1k+ parts

$76.777

10k+ parts

-

790

$83.453

$80.115

$76.777

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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Perfect Parts

USA . 1,202 parts In-Stock

1+ parts

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100+ parts

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1,202

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Argo Parts USA

USA . 558 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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558

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-

-

Overview

Experience the next level of innovation with the CY8C5667LTI-LP041 by Infineon Technologies. Known for its superior quality and reliability, this multi-functional peripherals device offers a wide range of applications to suit your needs. With cutting-edge technology and top-notch performance, this product delivers unparalleled value and benefits to customers. Trust in Infineon Technologies to provide you with the best in the industry, making your projects easier and more efficient than ever before. Choose excellence, choose CY8C5667LTI-LP041.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on circuit boards, saves space and reduces assembly time.

Maximum Supply Voltage: 5.5 V

Ensures compatibility with a wide range of power sources for flexibility in usage.

Package Shape: SQUARE

Compact design for efficient use of space in electronic devices.

Power Supplies (V): 2/5

Versatile power supply options for different applications and requirements.

No. of Terminals: 68

Sufficient number of terminals for connectivity and integration with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances heat dissipation and minimizes overall product size.

Minimum Supply Voltage: 1.71 V

Can operate efficiently at lower power levels for energy-saving purposes.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides reliable and durable terminal connections for long-term use.

Ultraviolet Erasable: N

Offers secure data storage and prevents unintentional data loss or corruption.

Terminal Position: QUAD

Optimal terminal layout for ease of connectivity and compatibility with different interfaces.

Maximum Seated Height: 1 mm

Low-profile design for compact and streamlined product integration.

RAM Words: 16384

Sufficient memory capacity for storing and processing data effectively.

Width: 8 mm

Slim width profile for fitting into tight spaces and compact designs.

Boundary Scan: YES

Facilitates easy testing and debugging during development and maintenance processes.

Maximum Clock Frequency: 33 MHz

High clock speed for rapid data processing and efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering for reliable joint connections.

Length: 8 mm

Compact length for space-saving integration in electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

ROM Bits Size: 1048576 Bits

Offers ample storage capacity for program codes and data storage needs.

Technology: CMOS

Reliable and low-power consumption technology for efficient device operation.

Terminal Form: NO LEAD

Lead-free terminals for environmental friendliness and compliance with regulations.

Nominal Supply Voltage: 1.8 V

Stable voltage supply for consistent and reliable device performance.

Bus Compatibility: I2C; USB; PS/2

Broad bus compatibility for seamless integration with different communication protocols.

Terminal Pitch: 0.4 mm

Fine terminal pitch for compact design and efficient connectivity.

Moisture Sensitivity Level (MSL): 3

Describes how sensitive the product is to moisture, ensuring proper handling and storage.

No. of I/O Lines: 48

Sufficient number of input/output lines for versatile connectivity and data transfer capabilities.

Technical Specifications

Multi-functional Peripherals CY8C5667LTI-LP041 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

16384

ROM Bits Size:

1048576 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C5667LTI-LP041 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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