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ZPSD503B1-15L

STMicroelectronics

ZPSD503B1-15L by STMicroelectronics

ZPSD503B1-15L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its compact ceramic package ensures reliable performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,291 parts In-Stock

1+ parts

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2,291

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Digiode

USA . 1,010 parts In-Stock

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1,010

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Anansix

USA . 885 parts In-Stock

1+ parts

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885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$73.631

100+ parts

-

1k+ parts

$66.268

10k+ parts

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387

$73.631

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$66.268

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Corohmni

South Africa . 62 parts In-Stock

1+ parts

$82.167

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62

$82.167

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MKK Technologies

India . 1,723 parts In-Stock

1+ parts

$138.459

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1,723

$138.459

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DigiPath Technology Company

USA . 1,723 parts In-Stock

1+ parts

$138.459

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1,723

$138.459

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Parana Technologies

USA . 1,272 parts In-Stock

1+ parts

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$88.037

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1,272

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$88.037

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Corphita

USA . 443 parts In-Stock

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443

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Overview

Elevate your designs with the ZPSD503B1-15L from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral combines superior quality with exceptional performance, ensuring reliability for a wide range of applications, from consumer electronics to industrial automation. With its robust ceramic metal-sealed package and efficient design, it delivers unmatched value, enabling seamless integration and enhanced operational efficiency for your projects. Experience the benefits of STMicroelectronics’ commitment to excellence and innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust package material enhances reliability and longevity, making the product suitable for demanding environments.

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of space on circuit boards.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage ensures compatibility with a wide range of applications, providing flexibility in system design.

Address Bus Width: 16

The 16-bit address bus width enables access to a large memory space, supporting complex computations and data processing.

Package Shape: SQUARE

The square package shape provides a symmetrical layout, facilitating easier integration into various designs.

No. of Terminals: 68

With 68 terminals, the product supports numerous connections, making it versatile for different configurations.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style allows for effective heat dissipation, ensuring optimal performance and reliability during operation.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for energy-efficient operation and extended battery life in portable devices.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature supports its use in higher thermal environments, assuring consistent performance.

Minimum Operating Temperature: 0 °C

This temperature range ensures the product can perform in a variety of environments, maximizing its usability.

Terminal Position: QUAD

A quad terminal position simplifies PCB layout and aids in effective routing strategies, enhancing design efficiency.

Maximum Seated Height: 4.57 mm

The low profile seated height allows for more compact designs, suitable for space-constrained applications.

RAM Words: 512

With 512 RAM words, the product can handle moderate data processing tasks effectively, supporting a range of applications.

Width: 24.105 mm

The dimensions of 24.105 mm provide a balance between size and functionality, making it a suitable choice for various designs.

External Data Bus Width: 16

A 16-bit data bus width ensures quick data transfers, enhancing the overall performance of the system.

Maximum Clock Frequency: 34.48 MHz

A high clock frequency allows for faster processing speeds, making the product suitable for performance-critical applications.

Length: 24.105 mm

Consistent dimensions ensure compatibility with existing designs, facilitating easy integration into various projects.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates reliability and stability in typical operating environments, ideal for consumer applications.

Technology: CMOS

CMOS technology enhances power efficiency and speed, making it suitable for modern digital applications.

Terminal Form: J BEND

J bend terminals enhance mechanical strength and secure solder connections, ensuring a robust product lifespan.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5 V makes the product compatible with many existing systems and components.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows for integration into a variety of systems, increasing versatility and application potential.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch facilitates easier soldering and connections, enhancing manufacturing efficiency.

No. of I/O Lines: 40

Forty I/O lines provide extensive interfacing options, allowing for numerous peripheral connections in complex designs.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-15L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD503B1-15L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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