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STPCI2GEYI

STMicroelectronics

STPCI2GEYI by STMicroelectronics

STPCI2GEYI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V and supports USB, PCI, ISA, and PCMCIA bus compatibility. It features a 32-bit address bus width and operates at a clock frequency of up to 14.31818 MHz. Ideal for applications requiring compact design and efficient data handling in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,834

-

-

-

-

Vyrian

USA . 1,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,745

-

-

-

-

Anansix

USA . 1,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,372 parts In-Stock

1+ parts

$25.340

100+ parts

-

1k+ parts

$22.806

10k+ parts

-

1,372

$25.340

-

$22.806

-

Corohmni

South Africa . 370 parts In-Stock

1+ parts

$39.045

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$39.045

-

-

-

MKK Technologies

India . 734 parts In-Stock

1+ parts

$47.649

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$47.649

-

-

-

DigiPath Technology Company

USA . 734 parts In-Stock

1+ parts

$47.649

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$47.649

-

-

-

Corphita

USA . 4,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,556

-

-

-

-

Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

-

100+ parts

$30.297

1k+ parts

-

10k+ parts

-

1,316

-

$30.297

-

-

Overview

Unlock unparalleled performance and versatility with the STPCI2GEYI from STMicroelectronics. Renowned for its superior quality, this multi-functional peripheral seamlessly integrates into various applications, enhancing data communication and system efficiency. With robust reliability and a compact design, it perfectly meets the demands of modern electronic environments, ensuring users benefit from faster processing and exceptional power savings. Elevate your projects to new heights with ST's trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic devices, optimizing space usage.

Maximum Supply Voltage: 2.7 V

With a maximum supply voltage of 2.7 V, this product consumes low power, making it energy-efficient for extended use.

Address Bus Width: 32

The 32-bit address bus width enables efficient data processing and communication, enhancing system performance.

Package Shape: SQUARE

The square package shape offers balanced dimensions which helps in effective thermal management and easy mounting on PCBs.

No. of Terminals: 516

A high number of terminals facilitates extensive connectivity options, allowing integration with multiple peripherals and systems.

Package Style (Meter): GRID ARRAY

The grid array package style contributes to reliable performance by providing enhanced heat dissipation and signal integrity.

Minimum Supply Voltage: 2.45 V

With a minimum supply voltage of 2.45 V, this product offers flexibility in diverse voltage conditions, ensuring stable operation.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient space utilization on the PCB and ensures effective soldering operations.

Maximum Seated Height: 2.38 mm

A low maximum seated height provides a compact solution for systems with space constraints, helping to fit into tighter designs.

Width: 35 mm

A width of 35 mm is standard, promoting compatibility with various mounting configurations while maintaining a compact footprint.

Boundary Scan: YES

Incorporated boundary scan capability enhances testability and reliability in complex systems, aiding in fault detection and debugging.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer, significantly improving system throughput and efficiency.

Maximum Clock Frequency: 14.31818 MHz

The clock frequency supports efficient processing speeds, which is essential for supporting various peripheral operations.

Length: 35 mm

A consistent length of 35 mm maintains uniformity in design, ensuring compatibility with a variety of existing systems.

Technology: CMOS

The use of CMOS technology contributes to low power consumption and high efficiency, making this product ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enables easier placement and reliable connections on PCB surfaces, enhancing overall assembly quality.

Nominal Supply Voltage: 2.5 V

Operating at a nominal voltage of 2.5 V is beneficial for low-power scenarios, contributing to longer battery life in portable devices.

Bus Compatibility: USB; PCI; ISA; PCMCIA

Broad bus compatibility ensures that the product can easily connect with a wide range of devices and systems, increasing versatility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for efficient routing on PCBs while supporting dense circuit designs without compromising reliability.

No. of I/O Lines: 24

Having 24 I/O lines facilitates versatile input and output options, making this multi-functional peripheral highly adaptable to different applications.

Technical Specifications

Multi-functional Peripherals STPCI2GEYI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA; PCMCIA

Maximum Clock Frequency:

14.31818 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2GEYI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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