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STPCD0166BTC3

STMicroelectronics

STPCD0166BTC3 by STMicroelectronics

STPCD0166BTC3 by STMicroelectronics is a 32-bit multifunction peripheral IC with 388 terminals. It operates at a max clock frequency of 14.318 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, making it suitable for various commercial applications requiring high-speed data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,187 parts In-Stock

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1,187

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Anansix

USA . 1,163 parts In-Stock

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1,163

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Vyrian

USA . 1,061 parts In-Stock

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1,061

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,193 parts In-Stock

1+ parts

$20.474

100+ parts

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2,193

$20.474

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$52.361

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$47.125

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2,343

$52.361

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$47.125

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MKK Technologies

India . 826 parts In-Stock

1+ parts

$98.461

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826

$98.461

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DigiPath Technology Company

USA . 826 parts In-Stock

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$98.461

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826

$98.461

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Corphita

USA . 1,974 parts In-Stock

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1,974

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Assy Fe

Spain . 1,057 parts In-Stock

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1,057

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 43 parts In-Stock

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$62.605

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43

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$62.605

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Overview

Unlock the power of innovation with the STPCD0166BTC3 by STMicroelectronics, a top-tier manufacturer renowned for quality and reliability. This multi-functional peripheral device offers endless possibilities in various applications, providing customers with unparalleled value and benefits. Whether you're looking to enhance performance or streamline operations, this product exceeds expectations with its cutting-edge technology and unmatched advantages. Elevate your projects to new heights with the STPCD0166BTC3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for compact design and easy installation of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power input options.

Address Bus Width: 32

The wide address bus allows for efficient and fast data processing.

Package Shape: SQUARE

The square package shape enables easy integration into circuit layouts.

Bit Size: 32

The 32-bit architecture allows for handling of large amounts of data efficiently.

Power Supplies (V): 3.3

The 3.3V power supply ensures reliable and stable operation of the product.

No. of Terminals: 388

Having a large number of terminals enables connectivity to various external components.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and efficient layout of components.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability for easy assembly.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and physical connection to the circuit board.

Maximum Seated Height: 2.38 mm

The low maximum seated height enables slim and compact product design.

Width: 35 mm

The compact width allows for easy integration into various system configurations.

External Data Bus Width: 32

The wide external data bus width ensures high-speed data transfer between the product and external devices.

Maximum Clock Frequency: 14.318 MHz

The high maximum clock frequency allows for fast data processing and performance.

Length: 35 mm

The compact length contributes to the overall small form factor of the product.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures suitability for common operating environments.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

The multifunction peripheral IC type indicates versatile functionality for various tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The ball terminal form enables easy and reliable connection with the circuit board.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable performance within standard operating conditions.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA buses allows for seamless integration into various system architectures.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting of the product on the circuit board.

Speed: 66 rpm

The high speed rating ensures fast data processing and performance for efficient multitasking.

Technical Specifications

Multi-functional Peripherals STPCD0166BTC3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

0 TO 100 OPERATING CASE TEMPERATURE

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCD0166BTC3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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