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PSD502B1-90LI

STMicroelectronics

PSD502B1-90LI by STMicroelectronics

PSD502B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 5.5V, operating temp range from -40 °C to 85°C, and 512 RAM words. Ideal for industrial applications, it supports various bus compatibilities and features a compact ceramic package. Its surface mount design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

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2,220

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Digiode

USA . 1,499 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,499

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Vyrian

USA . 1,272 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,272

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 607 parts In-Stock

1+ parts

$49.851

100+ parts

-

1k+ parts

$44.866

10k+ parts

-

607

$49.851

-

$44.866

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Corohmni

South Africa . 900 parts In-Stock

1+ parts

$71.021

100+ parts

-

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10k+ parts

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900

$71.021

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MKK Technologies

India . 2,098 parts In-Stock

1+ parts

$93.742

100+ parts

-

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2,098

$93.742

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DigiPath Technology Company

USA . 2,098 parts In-Stock

1+ parts

$93.742

100+ parts

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10k+ parts

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2,098

$93.742

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Corphita

USA . 3,794 parts In-Stock

1+ parts

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3,794

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Parana Technologies

USA . 25 parts In-Stock

1+ parts

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100+ parts

$59.605

1k+ parts

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25

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$59.605

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Overview

Experience unparalleled performance with STMicroelectronics' PSD502B1-90LI, a top-tier multi-functional peripheral designed for reliability and efficiency in demanding applications. With robust industrial-grade specifications and exceptional environmental resilience, this device excels in high-precision systems, from automation to consumer electronics. Trust in STMicroelectronics' legacy of quality and innovation, ensuring you receive unmatched value and seamless integration for your projects. Elevate your technology with the PSD502B1-90LI today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust packaging ensures excellent durability and reliability, making the product suitable for demanding industrial environments.

Surface Mount: YES

The surface mount capability allows for more compact designs and efficient use of space on PCBs, facilitating modern manufacturing techniques.

Maximum Supply Voltage: 5.5 V

This flexible maximum voltage provides compatibility with a wide range of power supply systems and enhances the versatility of applications.

Address Bus Width: 16

The 16-bit address bus width enables the device to access a larger memory space, improving overall processing capabilities.

Package Shape: SQUARE

A square package shape is beneficial for thermal management and ensures uniform performance across different orientations on the PCB.

No. of Terminals: 68

Having 68 terminals allows for various connections, providing greater flexibility and functionality in multi-functional peripheral applications.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier package with a window offers effective heat dissipation, which can help in extending the operational lifespan of the product.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage enhances design flexibility, allowing the product to be used in battery-powered applications and low-power designs.

Maximum Operating Temperature: 85 °C

This high temperature tolerance allows it to function reliably in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this device reliable in cold environments, ensuring consistent performance.

Terminal Position: QUAD

The quad terminal positioning ensures better connectivity options and enhances the ease of soldering during assembly.

Maximum Seated Height: 4.57 mm

A controlled seated height ensures compatibility with standard PCB profiles, streamlining the manufacturing process.

RAM Words: 512

The 512 RAM words provide substantial temporary storage space for data processing, enhancing performance in applications requiring fast data access.

Width: 24.105 mm

Standard dimensions allow for optimized design integration and compatibility with existing PCB layouts.

External Data Bus Width: 16

A 16-bit external data bus width ensures efficient data handling and improved throughput for various applications.

Maximum Clock Frequency: 30 MHz

The ability to operate at a high clock frequency facilitates faster processing and improved performance for computation-heavy applications.

Length: 24.105 mm

The compact length helps minimize board space requirements, allowing for more efficient layouts in multi-functional designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness against extremes, making it perfect for industrial settings.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it an excellent choice for battery-operated devices.

Terminal Form: J BEND

The J-bend terminal form allows for secure mounting and improves soldering quality, contributing to long-term reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal 5 V is standard and ensures broad compatibility with existing electronic and computing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures this product can interface easily with multiple architectures, providing flexibility in system design.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for efficient layout design and is compatible with various soldering methods.

No. of I/O Lines: 40

With 40 I/O lines, this device offers extensive interfacing capabilities, allowing it to connect with multiple peripherals simultaneously.

Technical Specifications

Multi-functional Peripherals PSD502B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD502B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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