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CY8C3666AXI-037T

Infineon Technologies

CY8C3666AXI-037T by Infineon Technologies

CY8C3666AXI-037T by Infineon is a multi-functional peripheral with 100 terminals, operating at -40 to 85 °C. It features a max clock frequency of 33 MHz and supports bus compatibility for various interfaces like CAN, I2C, and UART. Ideal for industrial applications requiring high-speed data processing in compact designs.

Median Price

$10.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$10.400

1,500

-

-

-

$10.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,294

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

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-

-

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Digiode

USA . 247 parts In-Stock

1+ parts

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1k+ parts

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247

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,343 parts In-Stock

1+ parts

$8.840

100+ parts

$8.619

1k+ parts

$8.575

10k+ parts

-

1,343

$8.840

$8.619

$8.575

-

Ampacity Inc.

Singapore . 1,122 parts In-Stock

1+ parts

$8.840

100+ parts

-

1k+ parts

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1,122

$8.840

-

-

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Corohmni

South Africa . 1,903 parts In-Stock

1+ parts

$20.270

100+ parts

-

1k+ parts

-

10k+ parts

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1,903

$20.270

-

-

-

Modulus Dynamics

Lithuania . 1,137 parts In-Stock

1+ parts

$31.426

100+ parts

$30.169

1k+ parts

$28.912

10k+ parts

-

1,137

$31.426

$30.169

$28.912

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Aztec Data Supply Inc.

USA . 4,262 parts In-Stock

1+ parts

$43.314

100+ parts

-

1k+ parts

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10k+ parts

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4,262

$43.314

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Component Stockers USA

USA . 445 parts In-Stock

1+ parts

$200.070

100+ parts

-

1k+ parts

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10k+ parts

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445

$200.070

-

-

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Continental Prestige Electronics

USA . 5,126 parts In-Stock

1+ parts

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100+ parts

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5,126

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Argo Parts USA

USA . 4,812 parts In-Stock

1+ parts

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100+ parts

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4,812

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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450

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Corphita

USA . 132 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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132

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Overview

Discover the Infineon Technologies CY8C3666AXI-037T, a cutting-edge Multi-functional Peripherals device designed to elevate your projects to new heights. With Infineon's renowned reputation for quality and reliability, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile component is a game-changer. Experience the value and benefits it brings, from its high-speed operation to its maximum clock frequency of 33 MHz. Elevate your designs with the CY8C3666AXI-037T and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and easy portability.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing versatility in usage.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it suitable for use in various environments and conditions.

ROM Bits Size: 524288 Bits

With a large ROM capacity, this product can store and process a significant amount of data efficiently.

Technology: CMOS

CMOS technology ensures low power consumption, making the product energy-efficient and cost-effective in the long run.

Technical Specifications

Multi-functional Peripherals CY8C3666AXI-037T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

4096

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

CY8C3666AXI-037T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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