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MIMX8QX6CVLFZAC

NXP Semiconductors

MIMX8QX6CVLFZAC by NXP Semiconductors

Multifunction Peripherals; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$81.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$106.530

100+ parts

$84.680

1k+ parts

-

10k+ parts

-

184

$106.530

$84.680

-

-

Rochester

USA . 91 parts In-Stock

1+ parts

-

100+ parts

$65.040

1k+ parts

$58.190

10k+ parts

$54.770

91

-

$65.040

$58.190

$54.770

Verical

USA . 91 parts In-Stock

1+ parts

-

100+ parts

$81.300

1k+ parts

$72.737

10k+ parts

$68.463

91

-

$81.300

$72.737

$68.463

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,608 parts In-Stock

1+ parts

$72.076

100+ parts

-

1k+ parts

-

10k+ parts

-

4,608

$72.076

-

-

-

Vyrian

USA . 5,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,270

-

-

-

-

Anansix

USA . 2,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,696

-

-

-

-

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 271 parts In-Stock

1+ parts

$33.592

100+ parts

-

1k+ parts

-

10k+ parts

-

271

$33.592

-

-

-

Ampacity Inc.

Singapore . 101 parts In-Stock

1+ parts

$61.420

100+ parts

-

1k+ parts

-

10k+ parts

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101

$61.420

-

-

-

Modulus Dynamics

Lithuania . 3,951 parts In-Stock

1+ parts

$62.475

100+ parts

$62.475

1k+ parts

$62.475

10k+ parts

-

3,951

$62.475

$62.475

$62.475

-

Corphita

USA . 1,008 parts In-Stock

1+ parts

$68.283

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

$68.283

-

-

-

Microchip USA

USA . 1,770 parts In-Stock

1+ parts

$129.290

100+ parts

$127.040

1k+ parts

$125.910

10k+ parts

$124.790

1,770

$129.290

$127.040

$125.910

$124.790

UNI Independent Distributors

Spain . 4,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,282

-

-

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Continental Prestige Electronics

USA . 2,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,470

-

-

-

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Argo Parts USA

USA . 1,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,283

-

-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

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Technical Specifications

Multi-functional Peripherals MIMX8QX6CVLFZAC attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MIMX8QX6CVLFZAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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