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CY8C5467LTI-LP003

Infineon Technologies

CY8C5467LTI-LP003 by Infineon Technologies

CY8C5467LTI-LP003 by Infineon operates at 1.71-5.5V, with 16384 RAM words and 1048576 ROM bits. Ideal for industrial applications, it supports I2C, USB, PS/2 bus compatibility and has a max clock frequency of 33MHz.

Median Price

$11.525

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 895 parts In-Stock

1+ parts

$7.399

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$7.399

-

-

-

Farnell

UK . 98 parts In-Stock

1+ parts

$10.160

100+ parts

$6.620

1k+ parts

-

10k+ parts

-

98

$10.160

$6.620

-

-

Mouser Electronics

USA . 1,362 parts In-Stock

1+ parts

$12.890

100+ parts

$8.700

1k+ parts

$8.110

10k+ parts

-

1,362

$12.890

$8.700

$8.110

-

DigiKey

USA . 567 parts In-Stock

1+ parts

$12.890

100+ parts

$8.697

1k+ parts

$8.109

10k+ parts

$7.933

567

$12.890

$8.697

$8.109

$7.933

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$14.100

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$14.100

-

-

-

Element14

Singapore . 95 parts In-Stock

1+ parts

$17.710

100+ parts

$12.030

1k+ parts

-

10k+ parts

-

95

$17.710

$12.030

-

-

Rochester

USA . 2,456 parts In-Stock

1+ parts

-

100+ parts

$7.300

1k+ parts

$6.530

10k+ parts

$6.140

2,456

-

$7.300

$6.530

$6.140

Verical

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

$9.125

1k+ parts

$8.162

10k+ parts

$7.675

1,531

-

$9.125

$8.162

$7.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 825 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

825

$6.555

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.663

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.663

-

-

-

TME

Poland . 875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.021

10k+ parts

-

875

-

-

$12.021

-

Vyrian

USA . 457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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457

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 92 parts In-Stock

1+ parts

-

100+ parts

-

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92

-

-

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Bristol Electronics

USA . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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92

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 830 parts In-Stock

1+ parts

$5.870

100+ parts

$5.723

1k+ parts

$5.694

10k+ parts

-

830

$5.870

$5.723

$5.694

-

Ampacity Inc.

Singapore . 828 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

-

10k+ parts

-

828

$5.870

-

-

-

Corphita

USA . 642 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$6.210

-

-

-

Component Stockers USA

USA . 4,879 parts In-Stock

1+ parts

$8.180

100+ parts

$7.870

1k+ parts

$7.530

10k+ parts

-

4,879

$8.180

$7.870

$7.530

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$8.663

100+ parts

-

1k+ parts

$8.230

10k+ parts

$8.057

500

$8.663

-

$8.230

$8.057

Microchip USA

USA . 1,125 parts In-Stock

1+ parts

$36.010

100+ parts

$35.490

1k+ parts

$35.240

10k+ parts

$34.980

1,125

$36.010

$35.490

$35.240

$34.980

Aztec Data Supply Inc.

USA . 4,407 parts In-Stock

1+ parts

$42.113

100+ parts

-

1k+ parts

-

10k+ parts

-

4,407

$42.113

-

-

-

Corohmni

South Africa . 151 parts In-Stock

1+ parts

$50.815

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$50.815

-

-

-

Modulus Dynamics

Lithuania . 2,156 parts In-Stock

1+ parts

$53.431

100+ parts

$51.294

1k+ parts

$49.157

10k+ parts

-

2,156

$53.431

$51.294

$49.157

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$70.628

100+ parts

$67.097

1k+ parts

$67.097

10k+ parts

-

2,500

$70.628

$67.097

$67.097

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QUARKTWIN TECHNOLOGY LTD

USA . 15,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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15,514

-

-

-

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Continental Prestige Electronics

USA . 4,081 parts In-Stock

1+ parts

-

100+ parts

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4,081

-

-

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Argo Parts USA

USA . 850 parts In-Stock

1+ parts

-

100+ parts

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850

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-

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Glotronic Ltd.

UK . 700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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700

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

-

-

-

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Perfect Parts

USA . 179 parts In-Stock

1+ parts

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100+ parts

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179

-

-

-

-

iodParts Technologies Inc.

India . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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92

-

-

-

-

Overview

Unlock endless possibilities with the CY8C5467LTI-LP003 by Infineon Technologies, a leading manufacturer known for quality and innovation. This multi-functional peripheral offers unparalleled value with its wide range of applications and features. From industrial automation to IoT devices, this product provides reliable performance and flexibility to meet your unique needs. Experience the benefits of seamless connectivity and efficient operation with the CY8C5467LTI-LP003, setting new standards in the industry.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power source options for the device.

Package Shape: SQUARE

Compact square shape allows for efficient use of board space in electronic designs.

Power Supplies (V): 2/5

Dual power supplies enable reliable operation and backup power capability.

No. of Terminals: 68

Sufficient number of terminals for connecting to various external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Advanced packaging technology ensures efficient heat dissipation and compact form factor.

Minimum Supply Voltage: 1.71 V

Allows for operation with low power sources, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Wide temperature range enables operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for durable connections.

Ultraviolet Erasable: N

Ensures data security by preventing accidental erasure of memory.

Terminal Position: QUAD

Quad terminal configuration allows for easy PCB layout and routing.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

RAM Words: 16384

Sufficient memory capacity for storing data and instructions.

Width: 8 mm

Compact width fits easily on small PCBs.

Boundary Scan: YES

Boundary scan capability facilitates testing and troubleshooting during production.

Maximum Clock Frequency: 33 MHz

High clock frequency for fast data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing process.

Peak Reflow Temperature °C: 260

Withstands high soldering temperatures for reliable connections.

Length: 8 mm

Compact length suitable for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges for robust performance.

ROM Bits Size: 1048576 Bits

Large ROM capacity for storing firmware and data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminals for environmentally-friendly and RoHS-compliant manufacturing.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent device operation.

Bus Compatibility: I2C; USB; PS/2

Supports multiple bus protocols for versatile connectivity.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for proper handling during assembly.

No. of I/O Lines: 48

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Multi-functional Peripherals CY8C5467LTI-LP003 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA99,9X11,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

16384

ROM Bits Size:

1048576 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C5467LTI-LP003 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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