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CY8C5288FNI-LP213T

Infineon Technologies

CY8C5288FNI-LP213T by Infineon Technologies

CY8C5288FNI-LP213T by Infineon Technologies is a multi-functional peripheral with 99 terminals, operating at a max clock frequency of 33 MHz. It features 32768 RAM words and supports various bus compatibilities like I2C, SPI, and UART. Ideal for industrial applications requiring a wide temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 776 parts In-Stock

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776

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Vyrian

USA . 565 parts In-Stock

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565

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 1,128 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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1,128

$5.000

$4.875

$4.850

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Ampacity Inc.

Singapore . 315 parts In-Stock

1+ parts

$18.000

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315

$18.000

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AZTECH Wire

Italy . 856 parts In-Stock

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$19.614

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856

$19.614

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Microchip USA

USA . 2,561 parts In-Stock

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$25.833

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2,561

$25.833

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$30.270

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100

$30.270

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Modulus Dynamics

Lithuania . 539 parts In-Stock

1+ parts

$41.613

100+ parts

$39.948

1k+ parts

$38.284

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539

$41.613

$39.948

$38.284

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Corohmni

South Africa . 2,939 parts In-Stock

1+ parts

$49.088

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2,939

$49.088

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Continental Prestige Electronics

USA . 6,779 parts In-Stock

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Argo Parts USA

USA . 2,392 parts In-Stock

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Corphita

USA . 700 parts In-Stock

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700

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock endless possibilities with the CY8C5288FNI-LP213T by Infineon Technologies, a cutting-edge multi-functional peripheral designed to revolutionize your projects. Infineon Technologies' reputation for top-quality products ensures reliability and performance like no other. With a wide range of applications in various industries, this product offers unmatched value, benefits, and advantages to customers seeking innovation and efficiency. Experience the difference with the CY8C5288FNI-LP213T and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy assembly and integration into various devices.

Maximum Supply Voltage: 5.5 V

Support for a higher maximum supply voltage provides flexibility in power options for the device.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power usage and compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures makes this product suitable for use in extreme cold environments.

RAM Words: 32768

Large RAM capacity enables the product to handle complex multitasking and data processing efficiently.

Maximum Clock Frequency: 33 MHz

High clock frequency allows for fast data processing and smooth operation of the device.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, enhancing the overall performance of the product.

Bus Compatibility: I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

Wide bus compatibility makes the product versatile and allows for easy interfacing with different systems and devices.

Technical Specifications

Multi-functional Peripherals CY8C5288FNI-LP213T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B99

JESD-609 Code:

e1

Length:

5.94 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

62

No. of Terminals:

99

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

32768

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5.192 mm

Trade Compliance

CY8C5288FNI-LP213T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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