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TDA2PSXVQACDRQ1

Texas Instruments

TDA2PSXVQACDRQ1 by Texas Instruments

TDA2PSXVQACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 16-bit address bus width, and 2.5M RAM words. Ideal for automotive applications, it features a max clock frequency of 38.4 MHz and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,728 parts In-Stock

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Digiode

USA . 2,442 parts In-Stock

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2,442

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Distributors (Availability)

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One Stop Electronics

USA . 153 parts In-Stock

1+ parts

$9.000

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153

$9.000

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AZTECH Wire

Italy . 898 parts In-Stock

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$19.461

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898

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Corohmni

South Africa . 1,071 parts In-Stock

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$20.504

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$20.504

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Parana Technologies

USA . 267 parts In-Stock

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$64.572

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267

$64.572

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DigiPath Technology Company

USA . 666 parts In-Stock

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$71.102

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666

$71.102

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ChromeModa Solutions

Germany . 1,919 parts In-Stock

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$72.553

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$59.493

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1,919

$72.553

$59.493

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IDEA Electronic Components Group

UK . 285 parts In-Stock

1+ parts

$72.553

100+ parts

$68.925

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$65.298

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285

$72.553

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$65.298

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Corphita

USA . 4,662 parts In-Stock

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Overview

Experience the cutting-edge technology of the TDA2PSXVQACDRQ1 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This multi-functional peripheral offers unparalleled versatility for a wide range of applications, including automotive systems and industrial equipment. With a high-performance design and innovative features, this product provides exceptional value and benefits to customers seeking superior performance and efficiency. Trust Texas Instruments to deliver excellence in every aspect with the TDA2PSXVQACDRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to wear and tear, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into various electronic systems.

Maximum Supply Voltage: 1.2 V

Operates within a safe voltage range, reducing the risk of damage due to overvoltage.

Address Bus Width: 16

Wide address bus allows for efficient data processing and communication within the device.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for compact and space-saving design, ideal for multifunctional peripherals.

No. of Terminals: 784

Ample number of terminals provide the necessary connections for versatile functionalities and features.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design offers high density and reliability in a compact form factor.

Minimum Supply Voltage: 1.11 V

Supports operation at low supply voltage, optimizing power efficiency and reducing energy consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures stable performance under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

Terminal finish with tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance, enhancing user-friendliness.

Maximum Seated Height: 1.63 mm

Low seated height enables compact and slim device design, suitable for space-constrained applications.

RAM Words: 2.5M

Large RAM capacity allows for efficient data storage and processing, enhancing the device's multitasking capabilities.

Width: 23 mm

Compact width dimension enables easy integration and space-saving installation in various electronic setups.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging of the device, ensuring high reliability and quality assurance.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speed and efficiency for seamless operation.

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency enables fast data processing and communication, essential for multitasking and high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

Robust peak reflow temperature duration of 30 seconds ensures proper soldering and assembly of the device for reliable performance.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance of 250°C ensures stable solder joints and component connections during manufacturing processes.

Length: 23 mm

Compact length dimension allows for versatile installation and integration in different electronic systems and devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating guarantees reliable operation in extreme temperature conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the device.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections, minimizing signal loss and ensuring stable data transmission.

Nominal Supply Voltage: 1.15 V

Stable nominal supply voltage ensures consistent and reliable operation of the device, optimizing performance and energy efficiency.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Wide bus compatibility enables seamless integration with various communication protocols and interfaces, enhancing connectivity and versatility.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density packaging and space-saving design, ideal for compact and multifunctional peripherals.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring proper handling and storage practices to prevent damage.

No. of I/O Lines: 247

Abundance of I/O lines enables versatile input and output functionalities, enhancing the device's connectivity and compatibility with external devices.

Technical Specifications

Multi-functional Peripherals TDA2PSXVQACDRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

784

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

TDA2PSXVQACDRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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