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PSD512B0-90JI

STMicroelectronics

PSD512B0-90JI by STMicroelectronics

PSD512B0-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features an industrial temperature range from -40 °C to 85°C and supports various bus types. Ideal for embedded systems, it offers reliable performance in demanding applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,805 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,805

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-

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Anansix

USA . 1,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,579

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Digiode

USA . 494 parts In-Stock

1+ parts

-

100+ parts

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494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 541 parts In-Stock

1+ parts

$64.113

100+ parts

-

1k+ parts

$57.702

10k+ parts

-

541

$64.113

-

$57.702

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MKK Technologies

India . 537 parts In-Stock

1+ parts

$120.560

100+ parts

-

1k+ parts

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10k+ parts

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537

$120.560

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DigiPath Technology Company

USA . 537 parts In-Stock

1+ parts

$120.560

100+ parts

-

1k+ parts

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10k+ parts

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537

$120.560

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-

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Corphita

USA . 2,728 parts In-Stock

1+ parts

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2,728

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Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

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100+ parts

$76.657

1k+ parts

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10k+ parts

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2,179

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$76.657

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Overview

Elevate your designs with the PSD512B0-90JI from STMicroelectronics, a trusted leader in the semiconductor industry. This versatile multi-functional peripheral promises exceptional performance and reliability, engineered to thrive in demanding environments. With its robust package and compatibility across various systems, it seamlessly integrates into diverse applications, enhancing efficiency and driving innovation. Experience unparalleled quality and support that empower your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mount allows for more compact designs and efficient use of PCB space, facilitating modern compact device implementations.

Maximum Supply Voltage: 5.5 V

This higher maximum supply voltage provides flexibility in power supply design, accommodating a range of applications.

Address Bus Width: 16

A 16-bit address bus allows for extensive addressing capabilities, enabling the connection to larger memory and peripheral configurations.

Package Shape: SQUARE

The square package shape provides an efficient layout for integration into PCB designs, optimizing space utilization.

No. of Terminals: 68

With 68 terminals, the device supports a substantial number of I/O connections, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style improves thermal performance and electrical connections, ideal for high-frequency operations.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage is low enough to ensure compatibility with low-power systems, improving energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this product suitable for industrial applications where higher thermal conditions are present.

Minimum Operating Temperature: -40 °C

The ability to function down to -40 °C makes this device ideal for extreme environments and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient mounting and connection layout, optimizing performance in design.

Maximum Seated Height: 4.57 mm

A low seated height enables more flexibility in design and helps maintain a low profile in compact applications.

Width: 24.1808 mm

A consistent width of 24.1808 mm facilitates standardization in PCB design, allowing for easy integration.

External Data Bus Width: 8

With an 8-bit external data bus width, the device supports common data rates and standards, enhancing compatibility.

Maximum Clock Frequency: 30 MHz

Supporting a maximum clock frequency of 30 MHz enables high-speed operation, ideal for performance-demanding applications.

Length: 24.1808 mm

The length corresponds with typical PCB dimensions, ensuring it can be effectively implemented in various designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this device ensures reliability in harsh environments, extending its operational life.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, making it energy-efficient and robust.

Terminal Form: J BEND

J-bend terminals offer improved soldering and attachment to PCBs, enhancing reliability in usage.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V provides compatibility with many existing systems, simplifying integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures flexibility and ease of integration into numerous systems, enhancing adoption in various applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for effective soldering and connection while maintaining compatibility with existing technology.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options for interfacing with other devices, enhancing functionality.

Technical Specifications

Multi-functional Peripherals PSD512B0-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD512B0-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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