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PSD502B1-90UI

STMicroelectronics

PSD502B1-90UI by STMicroelectronics

PSD502B1-90UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and 512 RAM words. It operates within a supply voltage of 4.5V to 5.5V and supports various bus types, making it ideal for industrial applications. Its low-profile design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,197 parts In-Stock

1+ parts

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2,197

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Digiode

USA . 1,400 parts In-Stock

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1,400

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Anansix

USA . 505 parts In-Stock

1+ parts

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505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 205 parts In-Stock

1+ parts

$53.796

100+ parts

-

1k+ parts

$48.416

10k+ parts

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205

$53.796

-

$48.416

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Corohmni

South Africa . 237 parts In-Stock

1+ parts

$81.656

100+ parts

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237

$81.656

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MKK Technologies

India . 1,761 parts In-Stock

1+ parts

$101.160

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1,761

$101.160

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DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$101.160

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1,761

$101.160

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Corphita

USA . 1,387 parts In-Stock

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1,387

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Parana Technologies

USA . 223 parts In-Stock

1+ parts

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$64.321

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223

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$64.321

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Overview

Unlock a world of possibilities with the PSD502B1-90UI from STMicroelectronics, a trusted leader in innovative multi-functional peripherals. Engineered for performance and reliability, this versatile device excels in demanding industrial applications, ensuring seamless integration and robust operation across various systems. With its compact design and exceptional temperature resilience, the PSD502B1-90UI offers unmatched value, empowering your projects with enhanced efficiency and longevity. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product well-suited for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space, facilitating the design of compact and high-density electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V is ideal for compatibility with a wide range of electronic systems, ensuring versatility in applications.

Address Bus Width: 16

The 16-bit address bus width supports a large amount of addressable memory, making this product suitable for complex applications.

Package Shape: SQUARE

The square package shape is optimal for space-efficient designs and offers uniform thermal performance.

No. of Terminals: 80

Having 80 terminals provides ample connection points for diverse functionalities, enhancing its adaptability to various tasks.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for easier integration into space-constrained environments without compromising performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage increases energy efficiency, making this product suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can function reliably in high-temperature industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C ensures performance in extreme cold conditions, ideal for outdoor applications.

Terminal Position: QUAD

Quad terminal positioning offers ease in soldering and improves electrical performance on printed circuit boards (PCBs).

Maximum Seated Height: 1.6 mm

A low seated height contributes to a compact design, allowing for high-density circuit layouts.

RAM Words: 512

512 RAM words support sufficient data processing capabilities for a variety of tasks, enhancing product performance.

Width: 14 mm

Compact width makes it suitable for small electronic devices and applications that demand space efficiency.

External Data Bus Width: 16

A 16-bit external data bus width enables faster data transfer rates, improving overall system performance.

Maximum Clock Frequency: 30 MHz

30 MHz clock frequency allows for high-speed operation, making this product ideal for performance-sensitive applications.

Length: 14 mm

The length of 14 mm further enhances the compact design, suitable for space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh operational conditions often found in industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and robust.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical stability of the component on the PCB.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 V aligns well with many digital circuits, ensuring compatibility across various applications.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility enhances integration possibilities with existing systems, making this product versatile for many applications.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for more terminals to fit within a given area, improving connectivity options and design density.

No. of I/O Lines: 40

With 40 I/O lines, the product can interact with multiple peripherals, increasing its functionality and usability in various applications.

Technical Specifications

Multi-functional Peripherals PSD502B1-90UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PSD502B1-90UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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