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ZPSD503B1-70LI

STMicroelectronics

ZPSD503B1-70LI by STMicroelectronics

ZPSD503B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications. Its ceramic, metal-sealed package ensures durability across -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,253 parts In-Stock

1+ parts

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2,253

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Digiode

USA . 1,274 parts In-Stock

1+ parts

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1k+ parts

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1,274

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Anansix

USA . 412 parts In-Stock

1+ parts

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412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 377 parts In-Stock

1+ parts

$48.755

100+ parts

-

1k+ parts

$43.880

10k+ parts

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377

$48.755

-

$43.880

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MKK Technologies

India . 1,078 parts In-Stock

1+ parts

$91.681

100+ parts

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1,078

$91.681

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DigiPath Technology Company

USA . 1,078 parts In-Stock

1+ parts

$91.681

100+ parts

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1,078

$91.681

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Corphita

USA . 3,647 parts In-Stock

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3,647

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Parana Technologies

USA . 225 parts In-Stock

1+ parts

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100+ parts

$58.294

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225

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$58.294

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Overview

Elevate your designs with the ZPSD503B1-70LI from STMicroelectronics, a trusted leader in innovative technology. This versatile multi-functional peripheral excels in high-performance applications, offering durability and efficiency for industrial environments. With its robust ceramic and metal-sealed package, it ensures reliability in extreme conditions. Experience unmatched value through superior power management and compatibility, making it an ideal choice for modern embedded systems. Unlock new possibilities with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package provides excellent durability and resistance to environmental factors, ensuring longevity and reliability in harsh conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic circuits, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for flexibility in power supply options, fitting a wide range of systems and improving compatibility.

Address Bus Width: 16

Having a 16-bit address bus width enhances memory addressing capabilities, allowing for larger data management and improved performance.

Package Shape: SQUARE

The square package shape optimizes space on PCBs, facilitating efficient layout and assembly in compact electronic designs.

Power Supplies (V): 5

Designed to operate at a standard 5 V, this product easily integrates with many pre-existing systems without requiring additional power conversion.

No. of Terminals: 68

A higher number of terminals (68) contributes to more connectivity options, promoting versatility in application usage.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window style enables visibility for inspection and easier mounting, enhancing assembly processes.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable performance across fluctuating power conditions, making it more stable in various environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is well-suited for industrial applications that may experience high heat.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C makes this product ideal for extreme temperature environments, enhancing its usability in diverse settings.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and is well-suited for various manufacturing processes, ensuring a reliable connection.

Ultraviolet Erasable: Y

The ultraviolet erasable feature allows for reprogramming and data retention flexibility, making it advantageous for applications requiring updates.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and design, allowing for efficient routing and reducing overall space requirements.

Maximum Seated Height: 4.57 mm

A low maximum seated height of 4.57 mm contributes to a compact profile, making this product ideal for space-constrained designs.

RAM Words: 512

Having 512 RAM words provides adequate data storage for moderate tasks, suitable for applications that do not require excessive memory.

Width: 24.105 mm

The width of 24.105 mm supports compatibility with standard PCB dimensions, helping streamline design processes.

External Data Bus Width: 16

A 16-bit external data bus width ensures efficient data transfer rates, enhancing overall system performance.

Maximum Clock Frequency: 36 MHz

Operating at a maximum clock frequency of 36 MHz allows for quicker processing speeds, making this product suitable for performance-intensive tasks.

Length: 24.105 mm

At a length of 24.105 mm, this product maintains a compact form factor, optimizing space without compromising functionality.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product can withstand the rigors of industrial environments, ensuring reliability and robustness.

ROM Bits Size: 1024 Bits

A ROM bits size of 1024 bits provides sufficient space for important firmware, ensuring proper functioning of connected devices.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption, making it energy-efficient and a great choice for battery-operated devices.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and installation, promoting ease of use during assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with commonly used standards, increasing compatibility and easing integration into existing systems.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility with multiple architectures enhances versatility, allowing for use in a wide range of applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard spacing between connections, facilitating easier PCB layout and soldering.

Maximum Standby Current: 0.00002 Amp

Extremely low maximum standby current enhances energy efficiency, making the product suitable for low-power applications.

Maximum Access Time: 0.00000007 ns

A very fast maximum access time ensures rapid data retrieval, critical for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines available, the product supports a wide range of interfacing options, increasing overall functionality.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD503B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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