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PSD503B1-15LI

STMicroelectronics

PSD503B1-15LI by STMicroelectronics

PSD503B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its compact ceramic package ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,351 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,351

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Vyrian

USA . 3,734 parts In-Stock

1+ parts

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-

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3,734

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Anansix

USA . 184 parts In-Stock

1+ parts

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184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 55 parts In-Stock

1+ parts

$38.494

100+ parts

-

1k+ parts

-

10k+ parts

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55

$38.494

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IDEA Electronic Components Group

UK . 1,159 parts In-Stock

1+ parts

$48.872

100+ parts

-

1k+ parts

$43.985

10k+ parts

-

1,159

$48.872

-

$43.985

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MKK Technologies

India . 224 parts In-Stock

1+ parts

$91.901

100+ parts

-

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224

$91.901

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DigiPath Technology Company

USA . 224 parts In-Stock

1+ parts

$91.901

100+ parts

-

1k+ parts

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224

$91.901

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Corphita

USA . 893 parts In-Stock

1+ parts

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893

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$58.434

1k+ parts

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775

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$58.434

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Overview

Elevate your designs with the PSD503B1-15LI from STMicroelectronics, a leader in innovation and quality. This multi-functional peripheral combines durable ceramic and metal-sealed construction for reliable performance across a range of industrial applications. With versatile compatibility and robust operating conditions, it ensures seamless integration and longevity in your projects. Trust STMicroelectronics for superior products that enhance efficiency and drive success.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed materials enhances durability and thermal stability, making the product reliable in various environmental conditions.

Surface Mount: YES

Surface mount technology enables compact design and easier integration into modern electronic systems, saving valuable board space.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for greater flexibility in system design and compatibility with a wider range of applications.

Address Bus Width: 16

With a 16-bit address bus, the product supports a large memory space, which is ideal for data-intensive applications.

Package Shape: SQUARE

The square package shape aids in uniformity in design and can improve heat dissipation in multi-functional peripherals.

Power Supplies (V): 5

The standard 5V power supply makes this product suitable for common applications without the need for specialized power sources.

No. of Terminals: 68

The high terminal count enables versatile connectivity options, allowing integration with multiple devices and peripherals.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style provides protection while allowing easy visibility for testing and inspection, facilitating easier maintenance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage ensures operational stability in low-power applications, making it effective for energy-efficient designs.

Maximum Operating Temperature: 85 °C

The capability to operate at high temperatures ensures reliability in harsh environments, widening the product's application range.

Minimum Operating Temperature: -40 °C

This extreme low-temperature operation makes the product suitable for aerospace, automotive, and other demanding applications.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and creates a strong electrical connection, ensuring long-term performance in various applications.

Ultraviolet Erasable: Y

The ability to be UV erasable allows for reprogramming, adding flexibility in development and deployment cycles.

Terminal Position: QUAD

Quad terminal positioning allows for efficient space management on PCBs, optimizing layout and performance.

Maximum Seated Height: 4.57 mm

Low seated height contributes to the compact design of electronic devices, making it an ideal choice for space-constrained applications.

RAM Words: 512

A sufficient RAM capacity of 512 words supports adequate data processing and storage for multi-functional applications.

Width: 24.105 mm

The moderate width enables flexible mounting options while contributing to a refined overall design.

External Data Bus Width: 16

A 16-bit external data bus enhances data throughput, making it suitable for high-performance applications.

Maximum Clock Frequency: 34.48 MHz

A high clock frequency allows the product to manage complex tasks efficiently, catering to demanding computing needs.

Length: 24.105 mm

The length complements the width, providing a balanced footprint that is suitable for a variety of applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness, making it ideal for harsh environments and critical applications.

ROM Bits Size: 1024 Bits

The sizable ROM allows for ample instruction storage, enhancing the function of the peripheral in diverse scenarios.

Technology: CMOS

CMOS technology provides lower power consumption and higher integration density, making this product energy efficient.

Terminal Form: J BEND

J-bend terminals facilitate secure connections and ease of assembly in various electronic configurations.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with widely used industrial electronics and reduces design complexity.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility makes it versatile, allowing integration into various existing systems without requiring redesign.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between component density and ease of handling during assembly.

Maximum Standby Current: 0.00002 Amp

Minimal standby current ensures energy efficiency, ideal for battery-operated or low-power applications.

Maximum Access Time: 0.00000015 ns

The ultra-fast access time significantly enhances data retrieval speeds, improving overall system performance.

No. of I/O Lines: 40

An ample number of I/O lines provides flexibility to connect various devices, making it a perfect fit for complex multi-functional tasks.

Technical Specifications

Multi-functional Peripherals PSD503B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

PSD503B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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