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ZPSD512B1-70LI

STMicroelectronics

ZPSD512B1-70LI by STMicroelectronics

ZPSD512B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications requiring reliability in extreme temperatures (-40 °C to 85 °C). With a max clock frequency of 36 MHz, it supports various bus architectures for seamless integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,821 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,821

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Anansix

USA . 2,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,705

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Vyrian

USA . 1,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$76.897

100+ parts

-

1k+ parts

$69.208

10k+ parts

-

2,194

$76.897

-

$69.208

-

MKK Technologies

India . 429 parts In-Stock

1+ parts

$144.600

100+ parts

-

1k+ parts

-

10k+ parts

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429

$144.600

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DigiPath Technology Company

USA . 429 parts In-Stock

1+ parts

$144.600

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$144.600

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-

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Corphita

USA . 2,662 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,662

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Parana Technologies

USA . 1,004 parts In-Stock

1+ parts

-

100+ parts

$91.942

1k+ parts

-

10k+ parts

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1,004

-

$91.942

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Overview

Unlock unparalleled performance with the ZPSD512B1-70LI from STMicroelectronics, a leader in innovation. This multi-functional peripheral boasts exceptional reliability, making it ideal for diverse applications from industrial automation to consumer electronics. Engineered with precision, its robust ceramic and metal-sealed design ensures durability in extreme conditions. Elevate your projects with cutting-edge technology that delivers unmatched efficiency and longevity!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures high reliability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space and easier integration into modern circuit designs.

Maximum Supply Voltage: 5.5 V

The maximum voltage rating provides flexibility in design, allowing for compatibility with various power supply configurations.

Address Bus Width: 16

A 16-bit address bus width enhances the ability to access a larger memory space, improving performance in data-intensive applications.

Package Shape: SQUARE

Square packaging helps in uniform heat distribution and simplifies layout in printed circuit boards.

Power Supplies (V): 5

Operating at a standard 5V supply makes it compatible with a wide range of existing systems and simplifies power supply considerations.

No. of Terminals: 68

The significant number of terminals provides extensive connectivity options for various peripherals and enhances functionality.

Package Style (Meter): CHIP CARRIER, WINDOW

Chip carrier packaging with a window allows for easy visual inspection and maintenance, facilitating debugging in development environments.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage accommodates a broader range of power sources, increasing design flexibility.

Maximum Operating Temperature: 85 °C

Designed to operate in high-temperature environments, ensuring reliability in extreme conditions typical in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes this product suitable for harsh climates and outdoor applications.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and provides a reliable connection for long-term performance.

Ultraviolet Erasable: Y

The UV erasable feature allows for easy reprogramming, making it ideal for development and prototyping.

Terminal Position: QUAD

Quad terminal positioning optimizes space utilization on the PCB and simplifies routing.

Maximum Seated Height: 4.57 mm

A low seated height allows for compact designs, enabling the development of miniaturized devices.

RAM Words: 1024

With 1024 RAM words, the product supports efficient data processing and storage for applications that require rapid access.

Width: 24.105 mm

The compact width aids in space-efficient designs, allowing for denser packing of components on the circuit board.

External Data Bus Width: 8

An 8-bit external data bus allows for effective communication with a range of devices while maintaining simplicity in design.

Maximum Clock Frequency: 36 MHz

A high clock frequency enables faster processing and enhances the throughput of data operations.

Length: 24.105 mm

The consistent length contributes to an even design footprint, making it easier to manage spatial constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation over a wide temperature range, making it ideal for demanding environments.

ROM Bits Size: 512 Bits

With a 512 Bits ROM size, this product provides sufficient read-only memory for essential firmware, supporting efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it suitable for battery-powered devices.

Terminal Form: J BEND

J-bend terminals facilitate space-efficient designs and guarantee reliable connections, enhancing product longevity.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V standardizes designs, offering compatibility with a wide array of existing systems.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility ensures seamless integration into existing systems, facilitating easier upgrades and expansions.

Terminal Pitch: 1.27 mm

A 1.27mm terminal pitch strikes a balance between density and manufacturability, simplifying PCB layout processes.

Maximum Standby Current: 0.00002 Amp

Ultra-low standby current maximizes energy efficiency, vital for battery-operated devices.

Maximum Access Time: 0.00000007 ns

Extremely fast access time allows for rapid data retrieval, enhancing the overall performance of the device.

No. of I/O Lines: 40

With 40 I/O lines, this product offers versatile interfacing capabilities for various peripherals, maximizing functionality.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD512B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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