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CY8C4247AZI-M475

Infineon Technologies

CY8C4247AZI-M475 by Infineon Technologies

CY8C4247AZI-M475 by Infineon Technologies is a versatile Multi-functional Peripheral IC with 16K RAM, 48 MHz Clock Frequency, and 51 I/O Lines. It is ideal for industrial applications requiring low profile components with a wide operating temperature range of -40 to 85 °C. The IC supports various bus compatibilities such as I2C, SPI, UART, IRDA, IDE, and LIN for flexible connectivity options.

Median Price

$4.572

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,588 parts In-Stock

1+ parts

$5.120

100+ parts

$3.280

1k+ parts

$3.220

10k+ parts

-

1,588

$5.120

$3.280

$3.220

-

DigiKey

USA . 563 parts In-Stock

1+ parts

$5.220

100+ parts

$3.699

1k+ parts

$3.212

10k+ parts

-

563

$5.220

$3.699

$3.212

-

Rochester

USA . 4,085 parts In-Stock

1+ parts

-

100+ parts

$3.220

1k+ parts

$2.880

10k+ parts

$2.710

4,085

-

$3.220

$2.880

$2.710

Verical

USA . 3,584 parts In-Stock

1+ parts

-

100+ parts

$4.025

1k+ parts

$3.600

10k+ parts

$3.388

3,584

-

$4.025

$3.600

$3.388

Flip Electronics (Authorized)

USA . 44 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

44

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 862 parts In-Stock

1+ parts

$3.392

100+ parts

-

1k+ parts

-

10k+ parts

-

862

$3.392

-

-

-

Vyrian

USA . 197 parts In-Stock

1+ parts

$3.570

100+ parts

-

1k+ parts

-

10k+ parts

-

197

$3.570

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Flip Electronics

USA . 44 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

44

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,142 parts In-Stock

1+ parts

$3.030

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$3.030

-

-

-

Corphita

USA . 295 parts In-Stock

1+ parts

$3.213

100+ parts

-

1k+ parts

-

10k+ parts

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295

$3.213

-

-

-

Component Stockers USA

USA . 33 parts In-Stock

1+ parts

$3.650

100+ parts

$3.430

1k+ parts

-

10k+ parts

-

33

$3.650

$3.430

-

-

Microchip USA

USA . 1,778 parts In-Stock

1+ parts

$17.976

100+ parts

-

1k+ parts

-

10k+ parts

-

1,778

$17.976

-

-

-

Modulus Dynamics

Lithuania . 4,253 parts In-Stock

1+ parts

$25.055

100+ parts

$24.053

1k+ parts

$23.051

10k+ parts

-

4,253

$25.055

$24.053

$23.051

-

Corohmni

South Africa . 15 parts In-Stock

1+ parts

$30.885

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$30.885

-

-

-

iodParts Technologies Inc.

India . 8,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,029

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

-

-

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Argo Parts USA

USA . 3,538 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,538

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Continental Prestige Electronics

USA . 1,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,238

-

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

-

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Overview

Experience the next level of performance and efficiency with the CY8C4247AZI-M475 by Infineon Technologies. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled reliability and versatility for a wide range of applications. From industrial automation to consumer electronics, this cutting-edge solution delivers exceptional value with its high-quality construction and innovative technology. Unlock new possibilities and elevate your projects with the CY8C4247AZI-M475.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making the product easy to handle and transport.

Surface Mount: YES

Surface mount capability allows for easy installation and integration in various electronic devices.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile and compatible with different power sources.

Package Shape: SQUARE

Square package shape saves space and allows for efficient stacking or placement in electronic assemblies.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact and streamlined design, ideal for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage helps in reducing power consumption and managing energy efficiently.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for operation in extreme cold conditions, increasing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish on terminals enhances conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of disconnection or interference.

Maximum Seated Height: 1.6 mm

Low seated height helps in compact and sleek device designs, optimizing space utilization.

RAM Words: 16K

Large RAM capacity of 16K words allows for efficient data storage and processing, enhancing performance.

Width: 10 mm

Compact width of 10 mm enables easy integration in various electronic setups without occupying much space.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency of 48 MHz supports fast data processing and smooth operation of the peripherals.

Length: 10 mm

Short length of 10 mm facilitates placement in tight spaces or compact devices, ensuring flexibility in design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Being a multifunction peripheral IC makes it versatile and capable of handling multiple tasks efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides structural strength and secure mounting, ensuring long-term durability.

Maximum Supply Current: 13.8 mA

Low maximum supply current consumption helps in energy efficiency and extends battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with standard power sources.

No. of Serial I/Os: 11

Having 11 serial I/Os allows for multiple communication connections and flexible data transfer options.

Bus Compatibility: I2C; SPI; UART; IRDA; IDE; LIN

Wide range of bus compatibility options facilitates seamless integration with various communication protocols and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enhances connectivity precision and efficiency in data transfer, improving overall performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures resistance to moisture and humidity, increasing the product's durability and reliability in different environments.

No. of I/O Lines: 51

Having 51 I/O lines provides ample input/output options, allowing for versatile connectivity and functionality in diverse applications.

Technical Specifications

Multi-functional Peripherals CY8C4247AZI-M475 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

I2C; SPI; UART; IRDA; IDE; LIN

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Serial I/Os:

11

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

16K

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

13.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

CY8C4247AZI-M475 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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