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ZPSD501B1-90LI

STMicroelectronics

ZPSD501B1-90LI by STMicroelectronics

ZPSD501B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, ideal for industrial applications requiring reliability in extreme temperatures (-40 °C to 85 °C). With a compact chip carrier design, it supports various bus systems for seamless integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,441

-

-

-

-

Vyrian

USA . 823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

823

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-

-

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Anansix

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$31.256

100+ parts

-

1k+ parts

$28.130

10k+ parts

-

2,245

$31.256

-

$28.130

-

MKK Technologies

India . 1,186 parts In-Stock

1+ parts

$58.775

100+ parts

-

1k+ parts

-

10k+ parts

-

1,186

$58.775

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-

-

DigiPath Technology Company

USA . 1,186 parts In-Stock

1+ parts

$58.775

100+ parts

-

1k+ parts

-

10k+ parts

-

1,186

$58.775

-

-

-

Corphita

USA . 3,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,020

-

-

-

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Parana Technologies

USA . 1,897 parts In-Stock

1+ parts

-

100+ parts

$37.371

1k+ parts

-

10k+ parts

-

1,897

-

$37.371

-

-

Overview

Unlock endless possibilities with the ZPSD501B1-90LI from STMicroelectronics—a powerhouse in multi-functional peripherals. Crafted from high-quality ceramic and metal-sealed materials, this component promises exceptional reliability and performance across a wide range of applications. Ideal for temperature-sensitive industries, it boasts superior efficiency and versatility that elevate your designs. Experience the unmatched value and innovative edge that only a trusted leader like STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction provides excellent protection against environmental factors, ensuring reliability and longevity in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easier, more compact installation on printed circuit boards, optimizing space and reducing overall product size.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages up to 5.5V, ensuring compatibility with various power supply designs.

Address Bus Width: 16

With a 16-bit address bus width, the device can handle larger memory spaces, making it suitable for advanced applications.

Package Shape: SQUARE

The square shape is advantageous for layouts requiring equal dimensions for ease of integration and thermal management.

Power Supplies (V): 5

The nominal 5V power supply aligns with common electronic standards, making it easy to power and integrate with existing systems.

No. of Terminals: 68

A high number of terminals enhances connectivity options, allowing for more input/output functionalities.

Package Style (Meter): CHIP CARRIER, WINDOW

The window package style aids in visual inspection and testing, contributing to quicker operational assessments in manufacturing.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5V increases flexibility in power management and battery-operated applications.

Maximum Operating Temperature: 85 °C

An extended temperature operating range ensures that this device performs reliably in high-temperature environments and demanding industrial applications.

Minimum Operating Temperature: -40 °C

Functionality at -40 °C makes it suitable for extreme environments, including outdoor and automotive applications.

Terminal Finish: TIN LEAD

A tin-lead terminal finish ensures robust solderability and reliable connections in electronics assembly.

Ultraviolet Erasable: YES

The ultraviolet erasable feature allows for flexible programming options and easy reprogramming, enhancing its versatility.

Terminal Position: QUAD

Quad terminal position enables more efficient routing and can lead to improved signal integrity in compact layouts.

Maximum Seated Height: 4.57 mm

The compact seated height is ideal for systems with limited vertical space, making this product fit for small form factor designs.

RAM Words: 512

Offering 512 RAM words enhances data storage capabilities, boosting performance in data-intensive applications.

Width: 24.105 mm

A standardized width makes it compatible with a variety of PCB designs and helps maintain consistent spacing across modules.

External Data Bus Width: 16

Support for a 16-bit data bus allows for efficient data transfer speeds, improving overall system performance.

Maximum Clock Frequency: 30 MHz

Operating at a clock frequency of 30 MHz ensures high-speed processing, making it suitable for demanding applications.

Length: 24.105 mm

The length aligns with standard component sizes, facilitating design integration into existing layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring performance and reliability under harsh environmental conditions.

ROM Bits Size: 256 Bits

With 256 bits of ROM, the product can store essential firmware, enhancing its functionality for primary operations.

Technology: CMOS

Using CMOS technology provides low power consumption and high-speed operation, making it energy-efficient.

Terminal Form: J BEND

J bend terminals provide good mechanical stability and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

The nominal 5V supply specifies standard operating conditions, ensuring compatibility with a wide range of devices.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility ensures that this peripheral can easily integrate with various processors and systems, enhancing design flexibility.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between ease of manual soldering and compact design.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current consumption enhances energy efficiency, especially in battery-powered devices.

Maximum Access Time: 0.00000009 ns

A fast access time ensures quick response and high performance during operation, meeting the demands of high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, the product supports a wide range of peripherals and features, enhancing its versatility for complex applications.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD501B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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