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DRA797BHGCBDRQ1

Texas Instruments

DRA797BHGCBDRQ1 by Texas Instruments

DRA797BHGCBDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it offers compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,616 parts In-Stock

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9,616

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Digiode

USA . 3,786 parts In-Stock

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3,786

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Native Components

USA . 12 parts In-Stock

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$7.962

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12

$7.962

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Northwest PG Solutions

USA . 615 parts In-Stock

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$8.758

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$7.882

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615

$8.758

$7.882

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AZTECH Wire

Italy . 610 parts In-Stock

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$18.340

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610

$18.340

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One Stop Electronics

USA . 314 parts In-Stock

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$32.000

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314

$32.000

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Parana Technologies

USA . 739 parts In-Stock

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$32.855

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$113.549

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739

$32.855

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$113.549

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DigiPath Technology Company

USA . 1,970 parts In-Stock

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$36.178

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$36.178

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

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$36.916

100+ parts

$35.070

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$33.224

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1,379

$36.916

$35.070

$33.224

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ChromeModa Solutions

Germany . 1,181 parts In-Stock

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$36.916

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$30.271

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1,181

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Corohmni

South Africa . 423 parts In-Stock

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$55.202

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423

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Microchip USA

USA . 2,689 parts In-Stock

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Corphita

USA . 993 parts In-Stock

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Overview

Experience the next level of innovation with the DRA797BHGCBDRQ1 by Texas Instruments, a cutting-edge solution in the Multi-functional Peripherals category. Designed with precision and quality in mind, this product offers unparalleled reliability and performance for a wide range of applications. With advanced features and superior technology, customers can enjoy seamless functionality and enhanced efficiency like never before. Trust Texas Instruments to deliver excellence, value, and unmatched benefits with the DRA797BHGCBDRQ1. Elevate your experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product durable and lightweight, ideal for portable devices.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in minimizing power consumption, making the product energy-efficient.

Address Bus Width: 16

With a wide address bus width of 16, the device can handle complex data processing tasks efficiently.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can perform consistently even in extreme conditions.

RAM Words: 512K

The large RAM size of 512K allows for storing and processing a significant amount of data, improving overall performance.

Technology: CMOS

The CMOS technology used in the product results in low power consumption and high-speed operation, making it an efficient choice.

Technical Specifications

Multi-functional Peripherals DRA797BHGCBDRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

186

No. of Terminals:

538

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

1.298 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DRA797BHGCBDRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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