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DRA718BIGCBDQ1

Texas Instruments

DRA718BIGCBDQ1 by Texas Instruments

DRA718BIGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and a max clock frequency of 38.4 MHz. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,436 parts In-Stock

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5,436

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Digiode

USA . 2,446 parts In-Stock

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2,446

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Distributors (Availability)

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$12.133

100+ parts

-

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475

$12.133

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One Stop Electronics

USA . 258 parts In-Stock

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$30.000

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258

$30.000

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Parana Technologies

USA . 553 parts In-Stock

1+ parts

$43.956

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553

$43.956

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DigiPath Technology Company

USA . 141 parts In-Stock

1+ parts

$48.401

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141

$48.401

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ChromeModa Solutions

Germany . 5,105 parts In-Stock

1+ parts

$49.389

100+ parts

$40.499

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5,105

$49.389

$40.499

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

1+ parts

$49.389

100+ parts

$46.920

1k+ parts

$44.450

10k+ parts

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2,239

$49.389

$46.920

$44.450

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Corohmni

South Africa . 575 parts In-Stock

1+ parts

$74.279

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575

$74.279

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Native Components

USA . 131 parts In-Stock

1+ parts

$562.100

100+ parts

$550.858

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$545.237

10k+ parts

$539.616

131

$562.100

$550.858

$545.237

$539.616

Northwest PG Solutions

USA . 751 parts In-Stock

1+ parts

$618.310

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751

$618.310

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Corphita

USA . 2,100 parts In-Stock

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2,100

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Microchip USA

USA . 1,054 parts In-Stock

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1,054

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Overview

Elevate your automotive electronics with the DRA718BIGCBDQ1 by Texas Instruments. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled performance and reliability. With a wide range of applications in CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB bus compatibility, this product provides seamless integration for your projects. Experience the value of cutting-edge technology and exceptional quality with Texas Instruments. Reach new heights in innovation with the DRA718BIGCBDQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, making this product suitable for long-term use.

Maximum Supply Voltage: 1.2 V

Operating within a safe maximum supply voltage ensures the product's stability and longevity.

RAM Words: 512K

With a large RAM capacity, this product can handle multiple tasks efficiently and store a significant amount of data.

Technology: CMOS

CMOS technology offers low power consumption and high speed, enhancing the overall performance of the product.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Support for multiple bus interfaces allows for versatile connectivity options, making this product compatible with a wide range of devices and systems.

Technical Specifications

Multi-functional Peripherals DRA718BIGCBDQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

186

No. of Terminals:

538

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DRA718BIGCBDQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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