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LS1027AXE7PQA

NXP Semiconductors

LS1027AXE7PQA by NXP Semiconductors

LS1027AXE7PQA by NXP Semiconductors is a Multi-functional Peripheral IC with 32-bit External Data Bus, 262144 RAM Words, and 448 Terminals. It operates in Industrial Temperature Grade range (-40 to 105 °C) and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact designs.

Median Price

$77.347

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,990 parts In-Stock

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$77.347

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Flip Electronics (Authorized)

USA . 135 parts In-Stock

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Digiode

USA . 2,645 parts In-Stock

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$79.648

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Nova Conductors

Japan . 71 parts In-Stock

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$79.940

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Maritex

Poland . 80 parts In-Stock

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$107.948

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Vyrian

USA . 7,284 parts In-Stock

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Anansix

USA . 737 parts In-Stock

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NAC Semi

USA . 180 parts In-Stock

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$90.650

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$83.680

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Flip Electronics

USA . 135 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 329 parts In-Stock

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$7.357

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$22.000

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Corphita

USA . 4,575 parts In-Stock

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$75.456

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Aranea Global

USA . 100 parts In-Stock

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$78.341

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$75.208

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Continental Prestige Electronics

USA . 3,922 parts In-Stock

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$79.940

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Corohmni

South Africa . 907 parts In-Stock

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$86.075

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QUARKTWIN TECHNOLOGY LTD

USA . 25,215 parts In-Stock

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Microchip USA

USA . 11,799 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 5,979 parts In-Stock

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Lixinc

USA . 4,860 parts In-Stock

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Argo Parts USA

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Vigor

Singapore . 78 parts In-Stock

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Overview

Elevate your project with the LS1027AXE7PQA by NXP Semiconductors, a top-tier manufacturer known for groundbreaking technology. This multi-functional peripheral device offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its advanced features and high-quality construction, this product guarantees value and reliability for all your electronic needs. Upgrade to the LS1027AXE7PQA and experience the next level of innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for everyday use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation in various applications.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures reliable performance under different operating conditions.

Address Bus Width: 14

A wider address bus width enhances data transfer speed and efficiency, making this product suitable for high-performance tasks.

Package Shape: SQUARE

The square package shape offers a compact design, saving space in cramped environments.

No. of Terminals: 448

The large number of terminals provides ample connectivity options for diverse peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array package style with fine pitch improves signal integrity and reduces electromagnetic interference.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures energy efficiency and extends the product's lifespan.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in cold environments without issues.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy and neat circuit board layout, enhancing overall system aesthetics.

Maximum Seated Height: 2.61 mm

The low maximum seated height allows for a compact overall design, suitable for space-constrained applications.

RAM Words: 262144

The large RAM capacity enables the product to handle complex multitasking and large data processing with ease.

Width: 17 mm

The compact width of the product makes it easy to integrate into various setups with limited space.

Boundary Scan: YES

The inclusion of boundary scan feature allows for efficient testing and debugging of the product during manufacturing and maintenance.

External Data Bus Width: 32

A wider external data bus width facilitates faster data transfer rates and improves system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The specified maximum time at peak reflow temperature ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the harsh soldering process without damage.

Length: 17 mm

The compact length of the product contributes to a space-saving design, suitable for compact or portable applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

The multifunction peripheral IC type offers versatile functionality, making the product a cost-effective and all-in-one solution for various applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form allows for reliable electrical connections and easy integration into various circuit board designs.

Nominal Supply Voltage: 1 V

The specified nominal supply voltage ensures stable and consistent operation under standard operating conditions.

No. of Serial I/Os: 8

The multiple serial I/Os provide flexibility for interfacing with external devices and peripherals, enhancing the product's connectivity options.

Bus Compatibility: I2C, SAI, SPI, UART

The compatibility with various bus protocols such as I2C, SAI, SPI, and UART enables seamless integration with different devices and systems.

Terminal Pitch: 0.75 mm

The specified terminal pitch allows for fine-pitch connections, ideal for compact and densely populated circuit board layouts.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the product's tolerance to moisture exposure, reducing the risk of damage during handling and storage.

No. of I/O Lines: 68

The numerous I/O lines provide ample connectivity options for interfacing with external devices and peripherals, expanding the product's functionality and versatility.

Technical Specifications

Multi-functional Peripherals LS1027AXE7PQA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, SAI, SPI, UART

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B448

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Serial I/Os:

8

No. of Terminals:

448

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,30X30,30

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

262144

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LS1027AXE7PQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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