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ZPSD513B1-15JI

STMicroelectronics

ZPSD513B1-15JI by STMicroelectronics

ZPSD513B1-15JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 34.48 MHz, ideal for industrial applications requiring reliable performance in extreme temperatures. With 1024 RAM words, it supports various bus compatibilities for diverse system integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,679

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Vyrian

USA . 3,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,735

-

-

-

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Anansix

USA . 1,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,298 parts In-Stock

1+ parts

$79.546

100+ parts

-

1k+ parts

$71.591

10k+ parts

-

1,298

$79.546

-

$71.591

-

MKK Technologies

India . 2,249 parts In-Stock

1+ parts

$149.581

100+ parts

-

1k+ parts

-

10k+ parts

-

2,249

$149.581

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-

-

DigiPath Technology Company

USA . 2,249 parts In-Stock

1+ parts

$149.581

100+ parts

-

1k+ parts

-

10k+ parts

-

2,249

$149.581

-

-

-

Corphita

USA . 4,075 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,075

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-

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Parana Technologies

USA . 1,709 parts In-Stock

1+ parts

-

100+ parts

$95.109

1k+ parts

-

10k+ parts

-

1,709

-

$95.109

-

-

Overview

Unlock the potential of your projects with the ZPSD513B1-15JI from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral is designed for reliability, boasting exceptional performance in demanding environments. With its robust temperature range and compatibility across various architectures, it empowers engineers to create cutting-edge applications in industrial automation, consumer electronics, and beyond—delivering unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, which is ideal for modern applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage ensures compatibility with a wide range of devices and components.

Address Bus Width: 16

A 16-bit address bus allows for access to a larger memory space, enhancing the product's performance.

Package Shape: SQUARE

The square package shape provides stability and efficient layout options for circuit boards.

Power Supplies (V): 5

Operating at a standard 5V simplifies power management and integration into existing systems.

No. of Terminals: 68

A higher number of terminals allows for greater connectivity and flexibility in design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports efficient thermal management and also allows easy handling during assembly.

Minimum Supply Voltage: 4.5 V

This flexible voltage requirement can support various operational scenarios and reduce power costs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low-temperature operation widens the range of environments where the product can be used effectively.

Terminal Finish: TIN LEAD

Tin-lead terminals provide excellent solderability and reliability in connections.

Terminal Position: QUAD

Quad terminal positioning supports efficient layout which is particularly useful in high-density applications.

Maximum Seated Height: 4.57 mm

A low profile design enables more compact board layouts, which is beneficial in space-constrained applications.

RAM Words: 1024

Offering substantial RAM capacity allows for efficient data processing and storage in multi-functional applications.

Width: 24.18 mm

Standard width facilitates easy integration into existing PCB designs without compromising space.

External Data Bus Width: 8

An 8-bit external data bus is suitable for interfacing with various microcontrollers, enhancing versatility.

Maximum Clock Frequency: 34.48 MHz

High clock frequency enables faster processing speeds, thus improving overall system performance.

Length: 24.18 mm

Standard length provides uniformity and ease of use in assembly and integration processes.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and longevity even in harsh environments.

ROM Bits Size: 1024 Bits

With 1024 bits of ROM, the product can store essential firmware and operational data efficiently.

Technology: CMOS

CMOS technology offers low power consumption, ensuring energy efficiency in the product's operation.

Terminal Form: J BEND

J-bend terminals allow for stable connections and efficient PCB layout options.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with most standard electronics, enhancing compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Its compatibility with multiple bus architectures increases its versatility for various applications.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm enables high-density packing on PCBs while ensuring easy soldering.

Maximum Standby Current: 0.00002 Amp

Low standby current consumption enhances energy efficiency, prolonging battery life in portable devices.

Maximum Access Time: 0.00000015 ns

Extremely fast access time ensures swift data retrieval, drastically improving overall system speed.

No. of I/O Lines: 40

A generous number of 40 I/O lines allows for extensive connectivity and functionality in one package.

Technical Specifications

Multi-functional Peripherals ZPSD513B1-15JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD513B1-15JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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