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ZPSD501B1-15LI

STMicroelectronics

ZPSD501B1-15LI by STMicroelectronics

ZPSD501B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a compact design and high-speed performance, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,332 parts In-Stock

1+ parts

-

100+ parts

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4,332

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Anansix

USA . 975 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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975

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Digiode

USA . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$71.583

100+ parts

-

1k+ parts

$64.425

10k+ parts

-

2,320

$71.583

-

$64.425

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MKK Technologies

India . 850 parts In-Stock

1+ parts

$134.608

100+ parts

-

1k+ parts

-

10k+ parts

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850

$134.608

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$134.608

100+ parts

-

1k+ parts

-

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850

$134.608

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-

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Corphita

USA . 1,445 parts In-Stock

1+ parts

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1,445

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Parana Technologies

USA . 526 parts In-Stock

1+ parts

-

100+ parts

$85.589

1k+ parts

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10k+ parts

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526

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$85.589

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Overview

Elevate your projects with the ZPSD501B1-15LI from STMicroelectronics, a leader in innovative semiconductor solutions. This robust multi-functional peripheral combines exceptional reliability with versatile applications, making it ideal for industrial systems, automotive tech, and consumer electronics. Experience superior performance and energy efficiency with this ceramic, metal-sealed chip carrier, designed to withstand extreme conditions while delivering seamless connectivity. Unlock possibilities with ST's commitment to quality and performance!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed body ensures high reliability and protection against environmental factors, making this product a robust choice for industrial applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on printed circuit boards, facilitating compact designs and easier integration into multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

Compatible with standard electronic components, this maximum supply voltage ensures safe and effective operation within various electronic systems.

Address Bus Width: 16

A 16-bit address bus width enhances data handling capabilities, allowing for better performance in managing larger data sets.

Package Shape: SQUARE

The square package shape allows for uniform placement in electronic assemblies, optimizing space and layout for better performance.

Power Supplies (V): 5

Operating at a standard 5V makes this product readily compatible with a wide range of existing equipment, reducing integration challenges.

No. of Terminals: 68

With 68 terminals, this device offers ample connectivity options, facilitating interaction with various components and peripherals.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with window style allows for easy access to the die, facilitating maintenance and testing.

Minimum Supply Voltage: 4.5 V

Operating effectively at a low supply voltage increases energy efficiency, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Capable of functioning at elevated temperatures, this product is suitable for high-temperature environments, enhancing reliability in demanding situations.

Minimum Operating Temperature: -40 °C

Withstand extreme cold temperatures, this product performs reliably in harsh conditions, making it ideal for industrial and outdoor applications.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and reliability of connections, ensuring lasting performance in various applications.

Ultraviolet Erasable: YES

Ultraviolet erasability offers flexibility in programming, allowing for easy updates and modifications to firmware or configuration.

Terminal Position: QUAD

The quad terminal position allows for efficient space usage on the PCB, enabling higher density designs without sacrificing performance.

Maximum Seated Height: 4.57 mm

A low seated height ensures compatibility with low-profile designs, saving valuable vertical space in electronic assemblies.

RAM Words: 512

512 RAM words provide ample memory for data processing, enabling smooth operations for complex multitasking applications.

Width: 24.105 mm

The compact width fits well in space-constrained designs, allowing for increased design flexibility.

External Data Bus Width: 16

A 16-bit external data bus width helps in processing larger amounts of data quickly, enhancing overall system performance.

Maximum Clock Frequency: 34.48 MHz

With a high clock frequency, the product is capable of excellent performance, making it suitable for high-speed applications.

Length: 24.105 mm

The length aligns with the width to create a square shape, optimizing PCB use and thermal management.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent reliability requirements, ensuring durability under challenging conditions.

ROM Bits Size: 256 Bits

A 256-bit ROM size provides sufficient storage for essential firmware, aiding in the product's versatile functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for portable and energy-efficient designs.

Terminal Form: J BEND

J bend terminals provide strong mechanical stability and reliable connections, enhancing overall durability.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V ensures compatibility with a wide range of devices and reduces power supply complexity.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility facilitates seamless integration with various existing systems and architectures, enhancing versatility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density designs, optimizing layout without compromising on performance.

Maximum Standby Current: 0.00002 Amp

Minimal standby current ensures energy efficiency, crucial for battery-powered or energy-conscious applications.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time enhances responsiveness and performance, making it suitable for high-speed operations.

No. of I/O Lines: 40

With 40 I/O lines, this product supports extensive interfacing options, making it a versatile choice for various peripheral applications.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD501B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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