Loading...

ZPSD512B0-70LI

STMicroelectronics

ZPSD512B0-70LI by STMicroelectronics

ZPSD512B0-70LI by STMicroelectronics is a versatile CMOS device with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz and supports various bus types, making it ideal for industrial applications. Its robust design ensures reliability in extreme temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,697

-

-

-

-

Anansix

USA . 2,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,171

-

-

-

-

Digiode

USA . 1,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,000 parts In-Stock

1+ parts

$78.653

100+ parts

-

1k+ parts

$70.787

10k+ parts

-

1,000

$78.653

-

$70.787

-

MKK Technologies

India . 1,066 parts In-Stock

1+ parts

$147.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$147.901

-

-

-

DigiPath Technology Company

USA . 1,066 parts In-Stock

1+ parts

$147.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$147.901

-

-

-

Corphita

USA . 2,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,801

-

-

-

-

Parana Technologies

USA . 747 parts In-Stock

1+ parts

-

100+ parts

$94.041

1k+ parts

-

10k+ parts

-

747

-

$94.041

-

-

Overview

Unlock the potential of your projects with the ZPSD512B0-70LI from STMicroelectronics, a leader in innovation and quality. This versatile multi-functional peripheral excels in demanding environments, delivering unmatched reliability from -40 °C to 85 °C. With its robust design and seamless compatibility across various architectures, it empowers engineers to streamline operations and enhance functionality, ensuring superior performance and long-term value for your applications.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package provides durability and excellent thermal characteristics, making the product reliable in demanding environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of circuits while protecting against over-voltage situations.

Address Bus Width: 16

With a 16-bit address bus, this product can access a larger memory space, enhancing overall system performance.

Package Shape: SQUARE

The square package shape makes it easier to integrate into various layout designs, promoting versatility in applications.

No. of Terminals: 68

A higher number of terminals enhances connectivity options, allowing for more functionalities to be implemented in a single chip.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design maximizes the use of space while offering window features for physical accessibility to the die.

Minimum Supply Voltage: 4.5 V

The ability to operate down to 4.5 V gives flexibility in powering with lower voltage supplies, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in various temperature conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C allows this product to function effectively in extreme cold environments.

Terminal Position: QUAD

Quad terminal positioning facilitates easier alignment and soldering on PCBs, offering better installation convenience.

Maximum Seated Height: 4.57 mm

A low seated height helps in maintaining a low profile design, making it suitable for compact electronic devices.

Width: 24.105 mm

A compact width allows for space-efficient integration in various applications, fitting well in tight environments.

External Data Bus Width: 8

With an 8-bit external data bus width, this product supports adequate data handling capabilities for many applications.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz allows for fast data processing and enhances overall system performance.

Length: 24.105 mm

A compact length complements the width to maintain an efficient, space-saving design that fits into various applications.

Temperature Grade: INDUSTRIAL

Industrial grade temperature ratings ensure that this product meets strict reliability standards for continuous operation in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: J BEND

J bend terminals allow for effective soldering and easier feeding into automated assembly systems, improving manufacturing efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a standard for many electronic devices, ensuring widespread compatibility.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility ensures that this product can be easily integrated into various system architectures, enhancing flexibility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and manufacturability, making it easy to handle during PCB assembly.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options, allowing for more peripherals and expanded capabilities in electronic systems.

Technical Specifications

Multi-functional Peripherals ZPSD512B0-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD512B0-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20