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CY8C5888FNI-LP214

Infineon Technologies

CY8C5888FNI-LP214 by Infineon Technologies

CY8C5888FNI-LP214 by Infineon is a multi-functional peripheral with 99 terminals, operating at 1.71-5.5V and -40 to 85°C. It features 32768 RAM words, supports I2C and USB bus compatibility, and operates at a max clock frequency of 33MHz. Ideal for industrial applications requiring high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 832 parts In-Stock

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Vyrian

USA . 282 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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AZTECH Wire

Italy . 705 parts In-Stock

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$11.505

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705

$11.505

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Semicontronic

India . 424 parts In-Stock

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$18.000

100+ parts

$17.550

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$17.460

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424

$18.000

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$17.460

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Ampacity Inc.

Singapore . 382 parts In-Stock

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$27.000

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382

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Corohmni

South Africa . 2,411 parts In-Stock

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$54.964

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$54.964

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Modulus Dynamics

Lithuania . 3,042 parts In-Stock

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$70.891

100+ parts

$68.055

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$65.220

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3,042

$70.891

$68.055

$65.220

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Continental Prestige Electronics

USA . 3,640 parts In-Stock

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Argo Parts USA

USA . 3,497 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,464 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,046 parts In-Stock

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Corphita

USA . 909 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the Infineon Technologies CY8C5888FNI-LP214, a cutting-edge multi-functional peripheral that delivers unmatched quality and reliability. Infineon, a renowned manufacturer known for innovative solutions, presents this versatile product designed for a wide range of applications. With a sleek design, advanced technology, and industrial-grade temperature tolerance, this product offers customers exceptional value and performance. Experience seamless connectivity with I2C and USB compatibility, high-speed operation up to 33 MHz, and ample RAM capacity. Elevate your projects with the CY8C5888FNI-LP214 and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages for versatile compatibility.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperature environments.

RAM Words: 32768

Offers a large RAM capacity for efficient multitasking and high-speed processing.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation.

Bus Compatibility: I2C; USB

Supports multiple bus interfaces for enhanced connectivity and integration with various devices.

Technical Specifications

Multi-functional Peripherals CY8C5888FNI-LP214 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

R-PBGA-B99

JESD-609 Code:

e4

Length:

5.94 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

62

No. of Terminals:

99

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5.192 mm

Trade Compliance

CY8C5888FNI-LP214 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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